Design, fabrication, investigation and analysis of a novel flat evaporator loop heat pipe for cooling high heat flux server chips

Xiong, Kangning; Meng, Like; Wang, Shuangfeng

doi:10.1016/j.applthermaleng.2021.117775

Cited by 32 publications

(4 citation statements)

References 35 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In [12], a novel solution was introduced in the form of a three-dimensional, flat plate, aluminum, pulsating heat pipe for the radial heat dissipation of high-power server chips. In [13], a loop heat pipe with a flat evaporator was proposed to ensure the heat dissipation requirement of a high heat flux server CPU. In [14], a U-shaped heat pipe-bonded heat sink was developed for CPU cooling.…”

Section: Introductionmentioning

confidence: 99%

Improvement in Laptop Heat Dissipation with Taguchi Method

Chang,

Chu,

Lin

2024

Electronics

View full text Add to dashboard Cite

This paper aims to investigate the feasibility of using system power consumption as a factor to improve laptop heat dissipation. The problems due to the CPU overheating are addressed. Based on the Taguchi method, the laptop fan parameters can be optimized with firmware adjustments only. In the Taguchi analysis, the fan speed, system power, and debounce time are considered as control factors, while the Cinebench point is utilized to evaluate the CPU performance. Experimental results demonstrate that the proposed heat dissipation scheme effectively reduces the idle time of a laptop fan. The improvement in heat dissipation can reduce CPU performance degradation because of overheating. According to the best combination of control factors, there is approximately a 5% increase in CPU performance despite a 0.35% increment in power consumption. This paper highlights the effectiveness of optimizing laptop fan parameters through firmware adjustments to improve heat dissipation and mitigate CPU overheating issues. Moreover, the study highlights the delicate balance between power consumption and performance gains. While there may be a slight increase in power consumption associated with the optimized heat dissipation scheme, the observed improvements in CPU performance outweigh this incremental power usage.

show abstract

Section: Introductionmentioning

confidence: 99%

Improvement in Laptop Heat Dissipation with Taguchi Method

Chang,

Chu,

Lin

2024

Electronics

View full text Add to dashboard Cite

show abstract

“…Among other things, electronic products are currently made with increasingly smaller sizes. Along with the development of this technology led researchers to find out the latest ways to keep electronic temperatures at reasonable limits [1]. An effective cooling system must be able to remove high heat flux and keep the device temperature at 85℃ [2].…”

Section: Introductionmentioning

confidence: 99%

Study of orientation effects to pool boiling heat transfer performance from the circular pin fins structure

Yasirul Khoiri,

Pranoto,

Muhammad Aulia Rahman

2024

tekno

View full text Add to dashboard Cite

Increasingly sophisticated technological advances generate heat that needs to be managed properly to ensure the optimality of the operation of these components. One solution offered is the pool boiling cooling method, which has a high heat transfer coefficient. This research aims to study how the orientation angle of the boiling pool affects the heat transfer coefficient. This approach aims to improve cooling effectiveness, especially in the context of moving systems, where the influence of orientation angle is an important factor. In the research related to pool boiling, various orientation angles from 0° to 20° were used on aluminum-based fins in the form of inline pin fins. These fins have a circular shape with a size of 30 mm × 30 mm. The working fluid used in this study is HFE-7100, which has dielectric properties. This study was conducted with heat levels ranging from 10 to 50 W before reaching the Critical Heat Flux (CHF) value. The results show that the orientation angle has a significant impact on the heat transfer coefficient as well as the dynamics of bubble formation. The results also indicate that the greater the orientation angle, the smaller the area of spread and bubble growth that occurs. This decrease in bubble growth area results in an increase in surface temperature. With the circular pin fins test specimen, an increase in surface temperature was found in this study, when the angle θ = 10° amounted to 1.08℃, for the angle θ = 20° amounted to 2.37℃ under the condition of q'' = 55.56 kW/m2. While the highest average value of heat transfer coefficient occurs at angle θ = 0°, the value reaches 3.91 kW/m2∙K and decreases at angle θ = 10° by 3.79%, for angle θ = 20° by 6.56%

show abstract

“…Hot spots seriously affect a chip's reliability and operational efficiency. However, traditional heat dissipation methods such as air cooling, liquid cooling [3], microchannels [4], heat pipes [5], etc., have struggled to effectively remove the large amount of heat generated when the chip works at a high power density [6]. Therefore, developing novel and efficient thermal management technologies is the key to improving the chip's performance and reliability.…”

Section: Introductionmentioning

confidence: 99%

The Transient Cooling Performance of a Compact Thin-Film Thermoelectric Cooler with Horizontal Structure

Ming,

Liu,

Zhang

et al. 2023

Energies

View full text Add to dashboard Cite

Thermoelectric cooling is an ideal solution for chip heat dissipation due to its characteristics of no refrigerant, no vibration, no moving parts, and easy integration. Compared with a traditional thermoelectric device, a thin-film thermoelectric device significantly improves the cooling density and has tremendous advantages in the temperature control of electronic devices with high-power pulses. In this paper, the transient cooling performance of a compact thin-film thermoelectric cooler with a horizontal structure was studied. A 3D multi-physics field numerical model with the Thomson effect considered was established. And the effects of impulse current, thermoelectric leg length, pulse current imposition time, and the size of the contact thermal resistance on the cooling performance of the device were comprehensively investigated. The results showed that the model achieved an active cooling temperature difference of 25.85 K when an impulse current of 0.26 A was imposed. The longer the length of the thermoelectric leg was, the more unfavorable it was to the chip heat dissipation. Due to the small contact area between different sections of the device, the effect of contact thermal resistance on the cooling performance of the device was moderate.

show abstract

Design, fabrication, investigation and analysis of a novel flat evaporator loop heat pipe for cooling high heat flux server chips

Cited by 32 publications

References 35 publications

Improvement in Laptop Heat Dissipation with Taguchi Method

Improvement in Laptop Heat Dissipation with Taguchi Method

Study of orientation effects to pool boiling heat transfer performance from the circular pin fins structure

The Transient Cooling Performance of a Compact Thin-Film Thermoelectric Cooler with Horizontal Structure

Contact Info

Product

Resources

About