Design for nanoimprint lithography: total layout refinement utilizing NIL process simulation

Kobayashi, Sachiko; Komori, Mika; Inanami, Ryoichi; Yamashita, K.; Mimotogi, Akiko; Im, Ji-Young; Hatano, Masayuki; Kono, Takuya; Maeda, Shunta

doi:10.1117/12.2219052

Cited by 4 publications

(3 citation statements)

References 5 publications

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“…Kobayashi et al reported that a friction force affecting the alignment rapidly increases when the residual layer thickness is smaller than 10 nm. 16) One of the causes of this increase in friction might be the increased viscoelasticity observed in this study. By quantitative comparison, differences between PAK-01 and isobornyl acrylate, such as the increase in the viscoelasticity of PAK-01 observed at larger gap widths and a larger amount of increase in viscoelasticity for PAK-01, were observed.…”

Section: Resultsmentioning

confidence: 73%

“…The viscoelasticity of the photoresist affects the time and pressure required in this molding process. [11][12][13][14][15] In addition, during alignment, the frictional force acting on the mold surface is dominated by the viscoelasticity of the photoresist sheared in the gap width between the mold and the substrate, 16) corresponding to the residual layer thickness. The viscoelasticity of a photoresist is an important factor that affects defect control, throughput, and alignment accuracy, all of which are important for high-volume manufacturing.…”

Section: Introductionmentioning

confidence: 99%

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Measurement of viscoelasticity of UV photoresist used for nanoimprint lithography under confinement in nanometer-sized gaps

Itoh

Takahashi

Fukuzawa

et al. 2017

Jpn. J. Appl. Phys.

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In UV nanoimprint lithography, the viscoelasticity of a photoresist is a dominant factor that affects defect control, throughput, and alignment accuracy, all of which are important for high-volume manufacturing. During the nanoimprint process, the photoresist is confined in nanogaps and nanocavities, between the mold and the substrate. In this study, we measure the viscoelasticity of a UV photoresist, PAK-01, confined in nanometer-sized gap widths by the sensitive shear force measurement method developed in our previous study. Experimental results show that PAK-01, a viscous liquid in the bulk state, turns into a viscoelastic liquid in the nanogaps. Qualitatively, a similar transition is observed with the typical acrylate monomer, isobornyl acrylate. These findings are significant factors that should be considered in the improvement of the accuracy and efficiency of nanoimprint lithography.

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Section: Resultsmentioning

confidence: 73%

Section: Introductionmentioning

confidence: 99%

Measurement of viscoelasticity of UV photoresist used for nanoimprint lithography under confinement in nanometer-sized gaps

Itoh

Takahashi

Fukuzawa

et al. 2017

Jpn. J. Appl. Phys.

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“…Only a few simulators are applicable to the nanoimprint process [11][12][13] , and these simulators are desired by device manufacturers as part of their everyday toolbox. [14][15][16] Similar to photolithography, computational methods are needed to optimize the lithographic process and reduce development times (See Figure 1.). Key computational solutions required to support the NIL ecosystem include:  Drop recipe generator: Automated drop generation is required to create production solution drop patterns that result in uniform residual layers and fast filling that eliminates non-fill defects  Simulation packages that predict the outcome of the NIL process.…”

Section: Introductionmentioning

confidence: 99%

NIL solutions using computational lithography for semiconductor device manufacturing

Aihara,

Yamamoto,

Nakano

et al. 2024

DTCO and Computational Patterning III

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Computational technologies are still in the course of development for nanoimprint lithography (NIL). Only a few simulators are applicable to the nanoimprint process, and these simulators are desired by device manufacturers as part of their daily toolbox. The most challenging issue in NIL process simulation is the scale difference of each component of the system. The template pattern depth and the residual resist film thickness are generally of the order of a few tens of nanometers, while the process needs to work over the entire shot size, which is typically of the order of 10 mm square. This amounts to a scale difference of the order of 10 6 . Therefore, in order to calculate the nanoimprint process with conventional fluid structure interaction (FSI) simulators, an enormous number of meshes is required, which results in computation times that are unacceptable. To support all lithographic systems, Canon has introduced "Lithography Plus", a software solution capable of anomaly detection, automatic recovery, trouble flow prediction and remote support. The software is now under development specifically for NIL. Because NIL is a rheological process, to software must address a completely new work flow. In this paper, we introduce the methods used to create drop patterns and refinements to the NIL process simulator which can be applied to predict resist filling and, in the future, be used to make corrections to the drop pattern virtually, thereby eliminating time consuming on-tool verification. Finally, we discuss the development of virtual metrology software that incorporates artificial intelligence to provide fast feedback on key tool outputs such as overlay.

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Molecular dynamics study of confined liquid film viscosity in Constant-Pressure and Constant-Distance systems

Chen,

Zhang,

Yokoyama

et al. 2024

Journal of Molecular Liquids

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Design for nanoimprint lithography: total layout refinement utilizing NIL process simulation

Cited by 4 publications

References 5 publications

Measurement of viscoelasticity of UV photoresist used for nanoimprint lithography under confinement in nanometer-sized gaps

Measurement of viscoelasticity of UV photoresist used for nanoimprint lithography under confinement in nanometer-sized gaps

NIL solutions using computational lithography for semiconductor device manufacturing

Molecular dynamics study of confined liquid film viscosity in Constant-Pressure and Constant-Distance systems

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