Design, Modeling, Fabrication and Characterization of 2–5-&lt;inline-formula&gt; &lt;tex-math notation="LaTeX"&gt;$\mu \text{m}$ &lt;/tex-math&gt; &lt;/inline-formula&gt; Redistribution Layer Traces by Advanced Semiadditive Processes on Low-Cost Panel-Based Glass Interposers

Lü, Hao; Furuya, Ryuta; Sawyer, Brett; Nair, Chandrasekharan; Liu, Fuhan; Tummala, Rao

doi:10.1109/tcpmt.2016.2556641

Cited by 36 publications

(3 citation statements)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…A radically different situation from 15 years ago, nowadays various through glass via technologies have been investigated including mechanical, laser, and gasdischarge drilling as well as hybrid technologies combing wet etching and laser drilling [15] (see Section II-B). Furthermore, silicon-like RDL wiring on glass panels has become feasible by extending semi-additive process (SAP) methods once developed for fabrication of BEOL layers on chips [25]. In retrospect, these technological pillars have been spurred by the unique properties of glass materials which combine the advantages of organic and silicon substrates.…”

Section: Introductionmentioning

confidence: 99%

RF Glass Technology Is Going Mainstream: Review and Future Applications

Chaloun¹,

Brandl²,

Ambrosius³

et al. 2023

IEEE J. Microw.

View full text Add to dashboard Cite

Driven by the increasing demand for high-throughput communication links and high-resolution radar sensors, the development of future wireless systems pushes at ever greater operating frequencies. By analogy, high-performance computing (HPC) systems with high-bandwidth I/Os have become a mainstream solution to address multi Gbit/s data rates. Heterogeneous integration technologies play a vital role here in enhancing the performance and functional density, along with reducing the size and costs of such RF systems. In line with this trend, many passive components, which have once been monolithically integrated, are now implemented on ceramic or polymer-based packages. Besides these long-established material and process technologies, considerable efforts have also recently been devoted to the development of RF components on glass and glass-ceramics. Spurred by their low dielectric losses, extremely smooth surfaces, and excellent dimensional stability, glass technologies are emerging as a promising alternative for high-volume and high-performance RF applications. In this article, relevant glass materials and key enabling technologies are reviewed and put into context with well-established RF substrate technologies. Another focus is set on the latest glass-based packaging and interposer solutions ranging from MHz-to-THz frequencies. To showcase the development activities and practical accomplishments of the RF glass technology, also a large variety of key components is presented. Finally, the paper concludes by discussing future research and development directions of RF glass devices.INDEX TERMS MTT 70th Anniversary Special Issue, glass technology, dielectrics, packaging, interposer, system-on-package, interconnects, filters, antennas, antenna-in-package, millimeter wave (mm-wave).

show abstract

Section: Introductionmentioning

confidence: 99%

RF Glass Technology Is Going Mainstream: Review and Future Applications

Chaloun¹,

Brandl²,

Ambrosius³

et al. 2023

IEEE J. Microw.

View full text Add to dashboard Cite

show abstract

“…The modifications are based on Defected Ground Structures (DGS) which are realized by 2-Dimensional etched symmetric areas on the metallic ground surface or on the signals trace of a CPW line. The transmission line with DGS has a unique property to prevent the propagation of electromagnetic waves in a specific frequency band along the transmission line [4].…”

Section: Introductionmentioning

confidence: 99%

Design and implementation of defected ground surface with modified co-planar waveguide transmission line

et al. 2019

View full text Add to dashboard Cite

This paper proposes a modified Co-Planar Waveguide (CPW) transmission line with Periodic Defected Ground Structures which can be used as a high-speed microwave channel for embedded antennas. CPW ground surface is modified by making slots of various shapes. The modified CPW channels are found suitable for Wi-MAX applications and a particular shape of DGS unit cell can be selected depending on the bandwidth requirement. The CPW transmission line with circular shaped DGS cells of two columns offer a remarkable value of the transmission coefficient of 0.89022 (− 1.01 dB) therefore it is fabricated and tested. It is observed that both the simulated and tested results agree with each other.

show abstract

“…Recently, the RDL was shrunken to fine pitch line/space (below 1.5 μm/1.5 μm) to increase the device density for high performance. 6,7 However, because of the anisotropic and poorly controlled etching of fine pitch lines, the SAP suffers from limitations such as undercutting, collapse, over-etching, and delamination during the Cu seed layer etching, 6,8 thereby decreasing the reliability of the package devices. Thus, the damascene process for RDL has been introduced to overcome these etching problems.…”

mentioning

confidence: 99%

Selective Copper Electrodeposition for Redistribution Layer by Varying Concentration and Agitation of Janus Green B

Lee,

Kim,

Han

et al. 2023

ECS J. Solid State Sci. Technol.

View full text Add to dashboard Cite

A fine-pitch redistribution layer (RDL) for high-performance devices in a fan-out wafer-level package (FOWLP) is required in semiconductor packaging technology. The damascene process for fine-pitch RDL has been studied for several years, which has been introduced to overcome the etching problems. Although surface planarization for removing overburden is necessary for the damascene process in RDL, it adds high cost to the FOWLP process. Selective Cu electrodeposition is a method used to prevent overburden. Janus Green B (JGB) is utilized as a leveler in Cu electrodeposition and has properties that depend on concentration and agitation. These properties affected the Cu deposition rate according to the pattern position. Thus, the electrochemical properties of JGB were investigated based on the concentration of JGB and agitation. Furthermore, the effect of JGB on the crystalline structure of the Cu film was examined. Additionally, changes in the growth behavior of the Cu nuclei caused by JGB were observed during the initial stage of chronoamperometry. Based on these results, selective Cu electrodeposition was successfully performed on the patterned substrate using the difference in the concentration of JGB and agitation.

show abstract

Design, Modeling, Fabrication and Characterization of 2–5-<inline-formula> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math> </inline-formula> Redistribution Layer Traces by Advanced Semiadditive Processes on Low-Cost Panel-Based Glass Interposers

Cited by 36 publications

References 5 publications

RF Glass Technology Is Going Mainstream: Review and Future Applications

RF Glass Technology Is Going Mainstream: Review and Future Applications

Design and implementation of defected ground surface with modified co-planar waveguide transmission line

Selective Copper Electrodeposition for Redistribution Layer by Varying Concentration and Agitation of Janus Green B

Contact Info

Product

Resources

About