Design, modelling and system level simulations of DRIE-based MEMS differential capacitive accelerometer

Mukhiya, Ravindra; Agarwal, Prakhar; Badjatya, S.; Garg, Manu; Gaikwad, P. K.; Sinha, Soumendu; Singh, Anurag; Gopal, Ram

doi:10.1007/s00542-018-04292-0

Cited by 33 publications

(16 citation statements)

References 10 publications

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“…From the fabrication point of view, etching techniques are divided into two main categories: deep reactive ion etching (DRIE) and anisotropy wet etching. Due to the etch rate being almost independent of the crystallographic orientation, DRIE can be utilized for etching arbitrarily shaped mask patterns to fabricate 3D structures with a high aspect radio and vertical sidewalls [5][6][7][8]. The micromechanical structures formed by DRIE have nonetheless been limited to those with vertical sidewalls such as a comb structure for pressure sensors and grating for optic sensors.…”

Section: Introductionmentioning

confidence: 99%

Curvature-Modulated Si Spherical Cap-Like Structure Fabricated by Multistep Ring Edge Etching

Wang

2020

Micromachines

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To create approximately spherical structures with curved sidewalls, this paper presents a method for building a series of decreasing slopes along the sidewall of a circular truncated cone. The multistep ring-edge etching technology of first reducing the concentric mask and then cutting the top off to create a mesa shape can be used to form the slopes. This wet-etching method avoids the constraints of crystallographic properties with surfactant-added Tetramethylammonium hydroxide (TMAH), enabling the manufacture of successive given inclination angles, the precise modulation of the spherical curvature by reduction design of concentric masks, and the setting of etching time. The newly approximated spherical Si microstructure patterns can be used for microlenses, quartz crystal resonators, micropulleys, and other applications. The present research is an approach to fabricate advanced microelectromechanical systems (MEMS) curved-surface structures, extending the range of 3D structures fabricated by silicon wet etching.

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Section: Introductionmentioning

confidence: 99%

Curvature-Modulated Si Spherical Cap-Like Structure Fabricated by Multistep Ring Edge Etching

Wang

2020

Micromachines

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“…The superior performance and successful implementation of capacitive MEMS transducers such as MEMS microphones [1], accelerometers [2], [3], gyroscopes [4], [5], pressure sensors [6], and micro-mirrors [7] in our everyday lives has motivated researchers to study the multi-physics domain of these tiny devices to improve their performance and to address their shortcomings. This improvement will gradually lead to devices for new applications such as endoscopic imaging, metrology, and energy harvesting [8]- [10].…”

Section: Introductionmentioning

confidence: 99%

Experimental Characterization of the Electrostatic Levitation Force in MEMS Transducers

Daeichin

Miles

Towfighian

2020

Journal of Vibration and Acoustics

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In this study, a two-step experimental procedure is described to determine the electrostatic levitation force in MEMS transducers. In these two steps, the microstructure is excited quasi-statically and dynamically and its response is used to derive the electrostatic force. The experimental results are obtained for a 1 by 1 plate that employs 112 levitation units. The experimentally obtained force is used in a lumped parameter model to find the microstructure response when it is subjected to different dynamical loads. The natural frequency and the damping ratios in the model are identified from the experimental results. The results show this procedure can be used as a method to extract the electrostatic force as a function of the microstructure's degrees of freedom. The procedure can be easily used for any microstructure with a wide variety of electrode configurations to predict the response of the system to any input excitation.

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“…MEMS acceleration sensors are divided into capacitive [ 6 , 7 ], piezoelectric [ 8 , 9 ], piezoresistive [ 10 , 11 ], Hall effect [ 12 , 13 ], magnetoresistive [ 14 , 15 ] and heat transfer [ 16 , 17 ] types according to the sensing method used. The most common type of MEMS acceleration sensors are capacitive because of their simple structure, high productivity, linear stability, durability, and insensitivity to temperature [ 18 , 19 ].…”

Section: Introductionmentioning

confidence: 99%

Cantilever Type Acceleration Sensors Made by Roll-to-Roll Slot-Die Coating

Lee

2020

Sensors

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This paper presents the fabrication by means of roll-to-roll slot-die coating and characterization of air gap-based cantilever type capacitive acceleration sensors. As the mass of the sensor moves in the opposite direction of the acceleration, a capacitance change occurs. The sensor is designed to have a six layers structure with an air gap. Fabrication of the air gap and cantilever was enabled by coating and removing water-soluble PVA. The bottom electrode, the dielectric layer, and the sacrificial layer were formed using the roll-to-roll slot-die coating technique. The spacer, the top electrode, and the structural layer were formed by spin coating. Several kinds of experiments were conducted for characterization of the fabricated sensor samples. Experimental results show that accelerations of up to 3.6 g can be sensed with an average sensitivity of 0.00856 %/g.

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Design, modelling and system level simulations of DRIE-based MEMS differential capacitive accelerometer

Cited by 33 publications

References 10 publications

Curvature-Modulated Si Spherical Cap-Like Structure Fabricated by Multistep Ring Edge Etching

Curvature-Modulated Si Spherical Cap-Like Structure Fabricated by Multistep Ring Edge Etching

Experimental Characterization of the Electrostatic Levitation Force in MEMS Transducers

Cantilever Type Acceleration Sensors Made by Roll-to-Roll Slot-Die Coating

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