Design of a Chip on Board (COB) LED Based Industrial Luminaire with Thermal Simulations

Abstract

As the equipment is improving, the luminous efficacy of Chip on Board (COB) LEDs are increasing. In this study, the utilization of COB LEDs in an industrial high-bay luminaire, which can be considered as a relatively high power application, has been investigated starting from the initial design process. For an industrial hall, single-chip LED based reference luminaires, which can provide the required lighting quality criteria have been identified. COB LED selection and photometric measurements are done, and the number of COB LEDs to be used has been calculated by targeting the luminous flux value of reference luminaires. The COB LED based luminaire prototype with a plate finned heat sink was modelled by using a CAD software and the computer aided thermal simulations were performed. Then the prototype was manufactured and experimentally analysed. The highest difference between the experimental analysis and the thermal simulation was found to be less than 7 %, which demonstrates the consistency of design and analyses. This study is an example of the steps to be followed in the manufacturing stage of a COB LED based luminaire. Additionally, it is aimed to provide a perspective to the use of COB LEDs in high power applications.

M1 ve M2 aydınlatma sınıfı yollar için geliştirilen bir COB LED’li yol aydınlatma armatür modelinin optik tasarımı

“…LED'li aydınlatma araçlarının optik tasarımında power LED'ler yerine her geçen gün artan ışık verimi, mekanik tasarım basitliği ve maliyet avantajı açısından COB LED esaslı armatürler ön plana çıkmaktadır [30]. Literatürde power LED'li yol aydınlatma armatürlerine ilişkin lens tasarımı ve analizine yönelik oldukça fazla çalışma bulunmaktadır [33][34][35][36]. Ancak COB LED'li yol aydınlatma armatürlerinin optik tasarımına yönelik çalışmaların ise literatürde son yıllarda yer almaya başladığı görülmektedir [37][38][39].…”

Study on photothermal coupling of COB lamp belt

“…COB(Chips on Board) is a technology to solve the LED heat dissipation problem. The bare chip is attached to the interconnection substrate with conductive or non-conductive adhesive, and then the electrical connection is realized by lead bonding [8]- [9]. A COB strip is a strip that encapsulates the chip on a soft board.…”