2021 IEEE MTT-S International Microwave Filter Workshop (IMFW) 2021
DOI: 10.1109/imfw49589.2021.9642297
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Design of a Compact, Highly-Integrated, Eight-Filter Module Using Multilayered-PCB

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“…To address the above challenging issues, researchers focus on exploring different fabrication processes to improve the integration and compactness, including multilayer printed circuit board (PCB) [3][4][5], low temperature cofired ceramic (LTCC) [6,7], silicon wafer [8][9][10][11], and other materials [12]. Multilayer PCB is often considered a low-cost technology, but it still suffers from the low integration density of electronic systems and low isolation.…”
Section: Introductionmentioning
confidence: 99%
“…To address the above challenging issues, researchers focus on exploring different fabrication processes to improve the integration and compactness, including multilayer printed circuit board (PCB) [3][4][5], low temperature cofired ceramic (LTCC) [6,7], silicon wafer [8][9][10][11], and other materials [12]. Multilayer PCB is often considered a low-cost technology, but it still suffers from the low integration density of electronic systems and low isolation.…”
Section: Introductionmentioning
confidence: 99%