“…For instance, for economical viability, a high deposition rate is often a prerequisite. This is one motivation for the extensive studies to which the expanding thermal plasma (ETP) has been subject, as this plasma source enables very high deposition rates in the order of tens of nm/ s for hydrogenated amorphous silicon (a-Si:H) [1], silicon oxide (SiO x ) [2][3][4], and diamond-like carbon (a-C:H) films [5]. The plasma deposited films become sufficiently dense for most applications only for substrate temperatures over 250 8C, especially when high growth rates are involved.…”