Design of a poly silicon MEMS microphone for high signal-to-noise ratio

Dehe, A.; Wurzer, M.; Füldner, M.; Krumbein, Ulrich

doi:10.1109/essderc.2013.6818876

Cited by 35 publications

(17 citation statements)

References 2 publications

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“…The pMUT has been fabricated using standard bulk micromachining fabrication techniques. Silicon nitride, silicon oxide and polysilicon are usually used as vibration diaphragms of MEMS devices, but the thicknesses of the three films are not more than 1 μm due to the deposition technique limits [ 37 , 38 , 39 , 40 ]. To get a higher and more accurate resonant frequency, the vibration diaphragm of pMUT should have greater and more precise thickness.…”

Section: Microfabrication Of Pmutmentioning

confidence: 99%

Design and Fabrication of Piezoelectric Micromachined Ultrasound Transducer (pMUT) with Partially-Etched ZnO Film

Ren

Fan

et al. 2017

Sensors

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A square piezoelectric composite diaphragm was analyzed by the finite element method to enhance the sensitivity of a piezoelectric micromachined ultrasound transducer (pMUT). The structures of electrode and piezoelectric film were optimized and a centric electrode was designed to avoid the counteraction of stress in the centre and edges. In order to further improve the sensitivity; a pMUT with partially-etched piezoelectric film was adopted. The receive and transmit sensitivities of the pMUT were analyzed in details. The receive sensitivity of pMUT with partially-etched ZnO film is 3.3 dB or 6.8 dB higher than those with a centric and whole electrode, respectively; and the amplitude of a partially-etched ZnO film pMUT under a certain voltage is 5.5 dB and 30 dB higher than those with centric and whole electrode separately. Two pMUT-based ZnO films were fabricated by micromachining technology and their receive and transmit sensitivities were tested. The ZnO films deposited by direct current (DC) magnetron sputtering exhibit a densely packed structure with columnar crystallites. The test results show that the structure of the square diaphragm with partially-etched piezoelectric layer can significantly improve the transducer sensitivity. The receive sensitivity and transmit sensitivity are −238.35 dB (ref. 1 V/μPa) and 150.42 dB (ref. 1 μPa/V); respectively.

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Section: Microfabrication Of Pmutmentioning

confidence: 99%

Design and Fabrication of Piezoelectric Micromachined Ultrasound Transducer (pMUT) with Partially-Etched ZnO Film

Ren

Fan

et al. 2017

Sensors

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“…The receiving sensitivity of the AM capacitive transducer can reach up to 0.4 / before amplification (as shown in Figure 6), however, the receiving sensitivity rapidly decreases to 0.009 m / when the diameter of the transducers decreases. The reason for this is that the smaller active area results in lower sensing energy and smaller capacitance change [29]. Figure 6 (a) also shows that the acoustic signal received by the AM transducer and the reference B&K microphone are very similar when both devices are operating at the resonant frequency of the AM transducer, nevertheless, this AM transducer set-up has less immunity to electromagnetic interference due to the absence of any shielding or proper packaging design.…”

Section: Resultsmentioning

confidence: 96%

Additive Manufacturing (AM) Capacitive Acoustic and Ultrasonic Transducers Using a Commercial Direct Light Processing (DLP) Printer

et al. 2020

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In recent years, there has been increasing interest in using additive manufacturing (3D printing) technology to fabricate sensors and actuators due to rapid prototyping, low-cost manufacturing processes, customized features and the ability to create complex geometries at micrometre scale. State of the art additive manufactured acoustic and ultrasonic transducers show limitations in miniaturization, repeatability (defects) and sensitivity. This new work encompasses the development of a capacitive acoustic and ultrasonic transducer, including its fabrication process using a commercial digital light processing printer and output signal characterization with a custom-made amplification circuit. A set of capacitive acoustic and ultrasonic transducers was fabricated and tested using different diaphragm diameters from. −. , for comparison, with central operating frequency between − , respectively. This capacitive transducer design has a receiving sensitivity of up to. / at its resonant frequency, and a comparison with a commercial reference microphone is provided.

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“…Although, the total interfacial energy is lower in coarse-grained materials than in fine-grained ones because of the less total boundary area in the former, thus, the ductility and electromigration factors should be taken into account. In the context of optimization requisite, dual poly-silicon corrugated membrane (from Infineon Tech., hybrid CMOS-MEMS microphone) need to be considered in design aspects to achieve sensitivity and SNR of -38dBV/Pa and 66dB, respectively [17]. Moreover, recently, Vesper piezoelectric MEMS microphone with 68dB SNR provides novel architecture over its capacitive counterpart [18].…”

Section: B Sem-tkd Analysis On Mems Regionmentioning

confidence: 99%

Nanostructural Analysis of CMOS-MEMS-Based Digital Microphone for Performance Optimization

Khan

Zheng

2016

IEEE Trans. Nanotechnology

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In this paper, systematic analysis on the digital microphone is performed using Energy Dispersive X-ray Spectroscopy (EDS) and Transmission Kikuchi diffraction (TKD) in the Scanning Electron Microscopy (SEM). Digital microphone is an integrated chip composed of Complementary Metal-Oxide Semiconductor (CMOS) and Micro-ElectroMechanical Systems (MEMS). Using EDS, quantitative chemical composition and elemental maps on the integrated CMOS-MEMS-based microchip were obtained. Microanalytical X-Ray technique along with TKD was applied to reveal the nanostructure of the MEMS region, i.e., diaphragm membrane and then the CMOS region, i.e., tungsten through-silicon via (W-TSV). Device performance and lifetime was correlated to chemical diffusions, metal interface boundaries, grain structures and phases existing at CMOS and MEMS junctions. Our results demonstrated that SEM-based TKD with EDS is a powerful microstructural characterization tool and performs vital role in failure analysis for device optimization. Topic -MEMS/NEMS Index Terms/Keywords-Energy Dispersive X-ray Spectroscopy (EDS), Scanning Electron Microphone (SEM), Transmission Kikuchi Diffraction (TKD), Complementary Metal-Oxide Semiconductor (CMOS), Micro-Electro-Mechanical Systems (MEMS), through-silicon via (TSV).

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Design of a poly silicon MEMS microphone for high signal-to-noise ratio

Cited by 35 publications

References 2 publications

Design and Fabrication of Piezoelectric Micromachined Ultrasound Transducer (pMUT) with Partially-Etched ZnO Film

Design and Fabrication of Piezoelectric Micromachined Ultrasound Transducer (pMUT) with Partially-Etched ZnO Film

Additive Manufacturing (AM) Capacitive Acoustic and Ultrasonic Transducers Using a Commercial Direct Light Processing (DLP) Printer

Nanostructural Analysis of CMOS-MEMS-Based Digital Microphone for Performance Optimization

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