1994
DOI: 10.1016/0042-207x(94)90242-9
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Design of a UHV reactor for microwave plasma deposition of diamond films

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Cited by 23 publications
(5 citation statements)
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“…53 The process conditions used for the microwave-assisted hydrogen plasma treatment of the diamond samples are given in Table 1 using UHV 2.45 GHz microwave plasma equipment. 54 The surface temperature of the grounded substrate was measured by a calibrated dual-wavelength pyrometer (Vanzetti model EITM2) operating at 1168 nm and 1250 nm, with a spot diameter of 0.38 cm at a working distance of 30 cm and a temperature resolution of Z 1% with a response time of 100 milliseconds.…”
Section: Methodsmentioning
confidence: 99%
“…53 The process conditions used for the microwave-assisted hydrogen plasma treatment of the diamond samples are given in Table 1 using UHV 2.45 GHz microwave plasma equipment. 54 The surface temperature of the grounded substrate was measured by a calibrated dual-wavelength pyrometer (Vanzetti model EITM2) operating at 1168 nm and 1250 nm, with a spot diameter of 0.38 cm at a working distance of 30 cm and a temperature resolution of Z 1% with a response time of 100 milliseconds.…”
Section: Methodsmentioning
confidence: 99%
“…1,2 In the initial carburization stage, the silicon wafer is treated for about 3 h in a 2.0% methane in hydrogen plasma at a low pressure of 35 Torr and a microwave power of 500 W. Removal of surface oxide and the formation of a silicon carbide layer on the substrate surface are believed to occur during the pretreatment process. The subsequent biasing nucleation stage is performed at a lower microwave power of 175 W with the gas pressure reduced to 22 Torr.…”
Section: Methodsmentioning
confidence: 99%
“…The diamond ®lms were prepared by 2.45 GHz microwave plasma enhanced chemical vapour deposition [1]. The growth of heteroepitaxial diamond on silicon substrate is a three stage process [2 ± 3].…”
Section: Methodsmentioning
confidence: 99%