Design of Electrically Conductive Adhesives and Adhesive Joints

Abstract

Electrically conductive adhesives (ECA’s) are used widely to replace or reinforce lead soldering or conductive metal components in electronic packaging applications such as die attachment, solderless interconnections, component repair, display interconnections, and heat dissipation. Their conductive behavior as well as the associated behaviors such as heat conduction and mechanical behavior (strength, rigidity, deformation and viscoelastic behavior, which may be affected by moisture ingression) are affected by adhesive film thickness, volume fraction, size and shape of the conductive filler, as well as uncured base adhesive viscosity, substrate and filler surface treatment and the applied pressure (during bonding and during conduction). The adhesive resistivity decreases precipitously above a characteristic filler volume fraction called the percolation threshold. In general, micron-sized metal fillers mixed in an adhesive (often an epoxy) resulting with different film thicknesses exhibit thickness thresholds for transition from three-dimensional conductivity to two-dimensional conductivity with considerable increases in thickness-direction (z-axis) resistivity when the film thicknesses are smaller than these threshold values. Recently, the use of conductive nanoparticles allowed decreases in percolation threshold levels as well as increases in mechanical strength and durability of ECA’s. Most ECA’s are supplied in liquid or paste form in varying viscosities and therefore, the method of their application also affects their performance. This work intends to provide an understanding of these effects on conduction behavior in (usually high-priced) equipment in which they are used.