Design of Flip-Chip Interconnects with Vertical Coaxial Transitions and Its Fabrication

Wu, Wei‐Cheng; Huang, Ruey-Bing; Hsu, Houtse; Chang, Edward Yi; Hsu, Lih‐Hsing; Huang, Chen-Hua; Hu, Yin-Chu; Lai, Ming-Iu

doi:10.1109/apmc.2005.1606431

2005 Asia-Pacific Microwave Conference Proceedings

DOI: 10.1109/apmc.2005.1606431

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Design of Flip-Chip Interconnects with Vertical Coaxial Transitions and Its Fabrication

Wei‐Cheng Wu

Ruey-Bing Huang

Houtse Hsu

et al.

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Design, Fabrication, and Characterization of Novel Vertical Coaxial Transitions for Flip-Chip Interconnects

Chang

Hwang

et al. 2009

IEEE Trans. Adv. Packag.

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Abstract-In this paper, a novel transition design using vertical "coaxial transition" for coplanar waveguide (CPW-to-CPW) flip-chip interconnect is proposed and presented for the first time. The signal continuity is greatly improved since the coaxial-type transition provides more return current paths compared to the conventional transition in the flip-chip structure. The proposed coaxial transition structure shows a real coaxial property from the 3-D electromagnetic wave simulation results. The design rules for the coaxial transition are presented in detail with the key parameters of the coaxial transition structure discussed. For demonstration, the back-to-back flip-chip interconnect structures with the vertical coaxial transitions have been successfully fabricated and characterized. The demonstrated interconnect structure using the coaxial transition exhibits the return loss below 25 dB and the insertion loss within 0.4 dB from dc to 40 GHz. Furthermore, the measurement and simulation results show good agreement. The novel coaxial transition demonstrates excellent interconnect performance for flip-chip interconnects and shows great potential for flip-chip packaging applications at millimeter waves.

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Design, Fabrication, and Characterization of Novel Vertical Coaxial Transitions for Flip-Chip Interconnects

Chang

Hwang

et al. 2009

IEEE Trans. Adv. Packag.

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Design of Flip-Chip Interconnects with Vertical Coaxial Transitions and Its Fabrication

Cited by 1 publication

References 8 publications

Design, Fabrication, and Characterization of Novel Vertical Coaxial Transitions for Flip-Chip Interconnects

Design, Fabrication, and Characterization of Novel Vertical Coaxial Transitions for Flip-Chip Interconnects

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