Design of high-frequency test fixture considering impedance matching

Abstract

This paper presents the design of a high-frequency test fixture for high-speed connectors. Specifically, after analyzing and designing the board material, laminate structure, trace structure, and signal via structure, the impedance consistency and bandwidth of the high-speed interconnect structure are verified through TDR and S-parameter simulations conducted in HFSS. a PCB layout is generated using Cadence. The test results confirm that the differential impedance of the fixture meets the requirements for high-speed connector testing. Within the frequency range of 0-30 GHz, the difference between S11 and S21 for the 2x-thru structure is greater than 0 dB, indicating a bandwidth capability of up to 30 GHz for the fixture.