2018
DOI: 10.1021/acsami.8b11930
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Design of Highly Water Resistant, Impermeable, and Flexible Thin-Film Encapsulation Based on Inorganic/Organic Hybrid Layers

Abstract: The lack of a transparent, flexible, and reliable encapsulation layer for organic-based devices makes it difficult to commercialize wearable, transparent, flexible displays. The reliability of organic-based devices sensitive to water vapor and oxygen must be guaranteed through an additional encapsulation layer for the luminance efficiency and lifetime. Especially, one of the major difficulties in current and future OLED applications has been the absence of thin-film encapsulation with superior barrier performa… Show more

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Cited by 78 publications
(58 citation statements)
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“…The gas barrier and the OLED were deposited on the textile platform, and the liquid passivation on which the gas barrier had formed was laminated to the OLED. The gas barrier that functioned as the OLED encapsulation to block moisture and oxygen 31 was fabricated using a spacer polymer 32,33 and the nano-stratified barrier of Al 2 O 3 and ZnO quasi-films [34][35][36][37][38] . The porous and defect-decoupling characteristics of the nanostratified structure enhanced the structural flexibility and barrier property.…”
Section: Strain Reduction Effect By the Strain Buffermentioning
confidence: 99%
“…The gas barrier and the OLED were deposited on the textile platform, and the liquid passivation on which the gas barrier had formed was laminated to the OLED. The gas barrier that functioned as the OLED encapsulation to block moisture and oxygen 31 was fabricated using a spacer polymer 32,33 and the nano-stratified barrier of Al 2 O 3 and ZnO quasi-films [34][35][36][37][38] . The porous and defect-decoupling characteristics of the nanostratified structure enhanced the structural flexibility and barrier property.…”
Section: Strain Reduction Effect By the Strain Buffermentioning
confidence: 99%
“…It is suitable to grow high-quality dielectric and semiconductor on different substrate even including the porous and high-aspect ratio substrates [39][40][41][42] , which has been widely used in areas of thin film solar cell, photodetectors and other electronic devices [43][44][45][46] . Besides, ALD is also a powerful method in thin film encapsulations for flexible electronics, due to the advantages of free pin-hole, excellent conformality and precise nanoscale thickness control on large area [47][48][49] . It is decent for surface defects passivation, dense thin film encapsulation, interstitial infilling and interface functional layers fabrication due to the characteristics of energy-dependent self-limiting reactions, dense uniform thin film fabrication, gas-phase infiltration and atomic level thickness control.…”
Section: (Iii) and (Iv)mentioning
confidence: 99%
“…Using this approach, Han et al and Kwon et al tried to fabricate flexible multibarriers based on ALD-Al 2 O 3 [44,45]. 30-and 60-nm-thick ALD-Al 2 O 3 was deposited using trimethylaluminum (TMA) and H 2 O at 70°C.…”
Section: Multilayer Thin-film Encapsulation Technology (Multibarrier)mentioning
confidence: 99%