Design of Microstrip-to-Microstrip Transition for High-Density Flip-Chip Interconnects

Yan, Qiaolin; Wu, Xuan; Deng, Tianwei

doi:10.1109/imws-amp54652.2022.10106931

2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-A 2022

DOI: 10.1109/imws-amp54652.2022.10106931

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Design of Microstrip-to-Microstrip Transition for High-Density Flip-Chip Interconnects

Qiaolin Yan

Xuan Wu

Tianwei Deng

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Design of Microstrip-to-Microstrip Transition for High-Density Flip-Chip Interconnects

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