Abstract:As technology scales down into the nanometer region new design challenges emerge. Wire delays become the performance bottleneck in VLSI circuits. Copper is introduced as new wiring material because of its low sheet resistivity, hence low signal propagation delay. The main defect mechanism shifts from shorts to opens due to the different manufacturing process for copper wires. Open defects limit functional yield. Parametric yield decreases because of timing uncertainties emerging from manufacturing variation. C… Show more
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