“…The improved probe would be able to directly contact the IC pins without the need for SMA connectors, allowing better convenience and reducing the component costs required for IC EMI noise measurement. To ensure the practicability of this probe, the EMI noise measurement methods proposed in [1,2,15] were adopted, which include two methods of noise measurement based on TEM_cell and magnetic probes. Simultaneously, the far-field measurement of CISPR 22 [16] has also been introduced, and the results of these three measurement methods are compared with the noise frequencies and levels obtained by this probe to find mutual correlation to verify the commercial reference value of noise obtained by this probe.…”