Design of Ultrasonic Horns by Photomechanics Methods

Abstract

In this paper, novel applications of experimental mechanics for verifying the design of ultrasonic horns for ultrasonic flip‐chip bonding are reported. Two photomechanics methods, i.e. amplitude‐fluctuation electronic speckle pattern interferometry (AF‐ESPI) and laser Doppler vibrometry were employed to measure the deformation of the ultrasonic horns. The experimental results confirmed the purely longitudinal resonant mode, the location of the nodal point and the high degree of coplanarity of the horn designed earlier by computer simulation.