Design Procedure of Continuous Profile Stopband Filters Implemented With Empty Substrate Integrated Coaxial Lines

Borja, Alejandro L.; Belenguer, Ángel; Esteban, H.; Boria, Vicente E.

doi:10.1109/tmtt.2019.2963661

Cited by 6 publications

(4 citation statements)

References 23 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Additionally, ESICL exhibits very low transmission and radiation losses while maintaining the cost-efficiency of planar technologies. Thanks to these exceptional advantages, several highperformance components have been developed, including filters [20]- [22], transitions to grounded coplanar and mi-crostrip lines [19], [23], power dividers [24], [25], and circulators [26]. However, no directional couplers have been designed before in this novel technology.…”

Section: Esicl a Transversal Section Designmentioning

confidence: 99%

High-Directivity and Low-Loss Directional Couplers Based on Empty Substrate Integrated Coaxial Line Technology

Herraiz,

Esteban,

Herraiz

et al. 2024

IEEE Access

Self Cite

View full text Add to dashboard Cite

High-directivity and low-loss directional couplers, based on Empty Substrate Integrated Coaxial Line (ESICL) technology, are presented in this article. The proposed coupled line direcional couplers, are based on combination of a high-isolation section, a tapering transition based on splines between the access lines and high-isolation sections, reduced-width coupled lines, and inclined arms. The design evolution has justified the combination and precise adjustment of these elements, proving to be a solution for enhancing directivity, reducing return losses, and attaining a more stable coupling coefficient. The use of the ESICL technology exhibits significant promise in terms of electrical performance, bandwidth, seamless integration with other planar circuits, and manufacturing simplicity. For comparison purposes, two directional couplers, with the same coupling coefficient but different operation frequencies, have been designed and manufactured. Additionally, a microstrip coupler has been designed and manufactured for comparison. The simulated and measured results clearly indicate that ESICL directional couplers outperform their microstrip counterparts in terms of losses and directivity, without the need for additional lumped elements or complex geometries.INDEX TERMS Empty substrate integrated coaxial line, directional couplers, transition, substrate integrated circuit, tapering structure, high directivity I. INTRODUCTIONT HE operating frequency of the satellite communication industry reveals a growing trend, moving towards the Ku, K, and Ka frequency bands [1]. This interest arises from the new communication systems requirements, particularly for emerging satellite communication systems based on small satellites, picosatellites, or nanosatellites, which demand higher bandwidth and throughput levels. This technological trend, while unable to entirely replace conventional satellite systems based on large satellites, introduces new paradigms in the development of novel and compact technological solutions. Consequently, this presents a significant challenge for microwave engineers, as they must develop passive components and equipment, such as filters, diplexers, antennas, and others, that strike a balance between electrical performance requirements, volume, weight, and manufacturing cost.Conventional communication satellite systems usually employ a payload implemented with waveguide technology, at least for the output stage. These components offer highquality electrical performance, high power-handling capabilities, and mechanical robustness [2]. However, they have significant drawbacks, including being bulky, heavy, expensive, and challenges while integrating other technologies. As an alternative, planar technologies, such as microstrip, coplanar,

show abstract

Section: Esicl a Transversal Section Designmentioning

confidence: 99%

High-Directivity and Low-Loss Directional Couplers Based on Empty Substrate Integrated Coaxial Line Technology

Herraiz,

Esteban,

Herraiz

et al. 2024

IEEE Access

Self Cite

View full text Add to dashboard Cite

show abstract

“…Planar circuit manufacturing processes have a long-term way. Many of the fabrication techniques of planar circuits can be applied to build 3D structures (substrateintegrated waveguides-SIW [1], empty substrate-integrated waveguides-ESIW [2], ridge empty substrate-integrated waveguides-RESIW [3], double-ridge empty substrate-integrated waveguides-DRESIW [4], substrate-integrated coaxial line-SICL [5] and empty substrate-integrated coaxial line-ESICL [6] or a combination with others as a continuous profile [7]) piling up layers of planar substrates.…”

Section: Introductionmentioning

confidence: 99%

Manufacturing Methods Based on Planar Circuits

Herraiz¹,

Martínez²,

Ballesteros³

et al. 2023

Hybrid Planar - 3D Waveguiding Technologies

View full text Add to dashboard Cite

Manufacture of hybrid 3D-planar circuits, especially those incorporating empty waveguides on substrates, can benefit from most standardized planar fabrication processes, although they are not exactly the same. For this reason, planar circuit manufacturing methods must be adapted to the requirements of these new circuits. Through numerous fabrications and successful designs, several enhancing strategies have been established to improve all the manufacturing phases to achieve better results. They all have been proved in the following substrate-integrated technologies for the manufacturing of microwave devices: ESIW, ESICL, continuous profile, and microstrip. Thanks to these improvements, good-quality prototypes such as transitions, filters, circulators, couplers, antennas, among others, have been fabricated. Throughout the next chapter, these strategies applied along the manufacturing process will be explained: from the first manufacturing phase to the final welding of the whole circuit and taking into account external elements such as wires that may be present in these structures. For this purpose, some devices that have been published will be used as examples.

show abstract

“…The generation of the high skirt factor is explained in Reference 15. Another Empty Substrate Integrated Coaxial Lines (ESICL) technique is deployed to get the UWB Bandstop filter response in Reference 16.…”

Section: Introductionmentioning

confidence: 99%

An ultra‐wideband bandstop filter with circularly etched stub resonator

Rajput

Chauhan

Mukherjee

2021

Micro & Optical Tech Letters

View full text Add to dashboard Cite

In this letter, an ultra‐wide band bandstop filter (BSF) with three transmission zeros and one reflection zero is presented. The role of the circular etched shaped stub as a notch pass response is investigated. Further, a compact size of 13 mm × 24.30 mm (0.219λg× 0.410λg) is achieved by employing an interdigital capacitor to increase coupling between the lines. Furthermore, the transmission line model of the filter is proposed, and consequently even and odd mode impedance is calculated analytically. The proposed filter offers an ultra‐wide bandwidth of 6.1 GHz (3.7 GHz‐9.8 GHz) with a rejection depth of 20 dB over the entire rejection band. Moreover, the upper skirt factor of 47.2 dB per GHz is achieved. A prototype of the proposed BSF is fabricated and measured. Simulated and measured results are in good agreement which validates the proposed design.

show abstract

Design Procedure of Continuous Profile Stopband Filters Implemented With Empty Substrate Integrated Coaxial Lines

Cited by 6 publications

References 23 publications

High-Directivity and Low-Loss Directional Couplers Based on Empty Substrate Integrated Coaxial Line Technology

High-Directivity and Low-Loss Directional Couplers Based on Empty Substrate Integrated Coaxial Line Technology

Manufacturing Methods Based on Planar Circuits

An ultra‐wideband bandstop filter with circularly etched stub resonator

Contact Info

Product

Resources

About