Novel schemes based on the design of complex three-dimensional
(3D) nanoscale architectures are required for the development of the
next generation of advanced electronic components. He+ focused-ion-beam
(FIB) microscopy in combination with a precursor gas allows one to
fabricate 3D nanostructures with an extreme resolution and a considerably
higher aspect ratio than FIB-based methods, such as Ga+ FIB-induced deposition, or other additive manufacturing technologies.
In this work, we report the fabrication of 3D tungsten carbide nanohelices
with on-demand geometries via controlling key deposition parameters.
Our results show the smallest and highest-densely packed nanohelix
ever fabricated so far, with dimensions of 100 nm in diameter and
aspect ratio up to 65. These nanohelices become superconducting at
7 K and show a large critical magnetic field and critical current
density. In addition, given its helical 3D geometry, fingerprints
of vortex and phase-slip patterns are experimentally identified and
supported by numerical simulations based on the time-dependent Ginzburg–Landau
equation. These results can be understood by the helical geometry
that induces specific superconducting properties and paves the way
for future electronic components, such as sensors, energy storage
elements, and nanoantennas, based on 3D compact nanosuperconductors.