2017
DOI: 10.1109/tcad.2016.2604288
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Design-Space Exploration and Optimization of an Energy-Efficient and Reliable 3-D Small-World Network-on-Chip

Abstract: A three-dimensional (3D) Network-on-Chip (NoC) enables the design of high performance and low power many-core chips. Existing 3D NoCs are inadequate for meeting the everincreasing performance requirements of many-core processors since they are simple extensions of regular 2D architectures and they do not fully exploit the advantages provided by 3D integration. Moreover, the anticipated performance gain of a 3D NoC-enabled many-core chip may be compromised due to the potential failures of through-silicon-vias (… Show more

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Cited by 64 publications
(36 citation statements)
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“…Conventional 2D architectures, such as mesh NoCs, cannot efficiently handle this many-to-few traffic or fulfill the quality of service (QoS) requirements for both CPU and GPU communication [7]. In recent years, designers have taken advantage of 3D IC's higher packing density and lower interconnect latency to improve the performance of manycore systems [4], [5]. The advantages of 3D integration for CPU and GPU based manycore systems have been demonstrated in [16], [17] where the authors have principally focused on improving the throughput and energy efficiency by using the benefits of 3D integration for homogeneous systems (all CPUs or all GPUs) only.…”
Section: D Heterogeneous Nocsmentioning
confidence: 99%
See 1 more Smart Citation
“…Conventional 2D architectures, such as mesh NoCs, cannot efficiently handle this many-to-few traffic or fulfill the quality of service (QoS) requirements for both CPU and GPU communication [7]. In recent years, designers have taken advantage of 3D IC's higher packing density and lower interconnect latency to improve the performance of manycore systems [4], [5]. The advantages of 3D integration for CPU and GPU based manycore systems have been demonstrated in [16], [17] where the authors have principally focused on improving the throughput and energy efficiency by using the benefits of 3D integration for homogeneous systems (all CPUs or all GPUs) only.…”
Section: D Heterogeneous Nocsmentioning
confidence: 99%
“…To further reduce data transfer costs, three-dimensional (3D) integrated circuits (ICs) have been investigated as a possible solution and have made significant strides towards improving communication efficiency [4], [5]. By connecting planar dies stacked on top of each other with through-silicon vias (TSVs), the communication latency, throughput, and energy consumption can be further improved [6].…”
Section: Introductionmentioning
confidence: 99%
“…Once a core is selected for a given task, the task delay is recalculated to reflect the new changes due to the impact of process and voltage variations on the selected core. XYZ-routing is used to handle data traffic [29], [61].…”
Section: -Children-slack Task Priority or Cstp: After Randommentioning
confidence: 99%
“…Exploration means collecting new information whereas the exploitation means using the existing information for communication among different individuals of the swarms to better manage their coordination. During solving the optimization problems, the exploration is the process of increasing the solution search space to bring variations in the values of optimization function (collecting new information) [30] whereas the exploitation means focusing on the so far found solutions to check all the nearby solutions to enable the search space to not skip the most optimal solution present in the local solution search space (using the existing information) [31].…”
Section: Introductionmentioning
confidence: 99%