Designing and Modeling for Power Integrity

Abstract

Designing and Modeling for Power Integrity / Swaminathan M.; Chung D.; Grivet-Talocia S.; Bharath K.; Laddha V.; Xie J.Abstract-After providing an overview of the state-of-the-art in power distribution design and modeling, this paper focuses on return path discontinuities (RPDs) for I/O signaling. After briefly describing their importance in the context of simultaneous switching noise, a specific case of RPD based on via discontinuities is discussed in detail in the context of both the frequency-and timedomain waveforms using a test vehicle. The modeling of RPD in practical packages and printed circuit boards is addressed along with substrate coupling due to nonideal reference planes. Finally, a high-impedance power distribution scheme for I/O signaling is presented that can potentially solve a number of RPD-related problems, followed by future challenges.Index Terms-Macro-modeling, passivity, power distribution, power integrity, return path discontinuity, signal integrity.

A Compact and Multi-Stack Electromagnetic Bandgap Structure for Gigahertz Noise Suppression in Multilayer Printed Circuit Boards

“…First, low-Z o patches in different tiers but the same VCA are considered, which is called an intra-VCA branch. In Figure 2a, the intra-VCA branch is highlighted with a blue dashed line, which connects the low-Z o patches in UC (4,2) to UC (4,3) . The other type is an inter-VCA branch, which connects low-Z o patches in different tiers and different VCAs.…”

“…The other type is an inter-VCA branch, which connects low-Z o patches in different tiers and different VCAs. In Figure 2a, for instance, the inter-VCA branch is highlighted to connect a low-Z o patch in UC (3,5) to a low-Z o patch in UC (4,4) . To more clearly explain the intra-/inter-VCA branches, only the low-Z o patches and VCA branches are shown in the other view point in Figure 2b, where the red and blue arrows point at the inter-VCA branches and intra-VCA branches, respectively.…”

“…For example, UC (1,5) has an intra-VCA branch to connect with UC (1,5) and an inter-VCA branch to connect with UC (2,4) . For UC (3,5) , two inter-VCA branches are used to connect with UC (2,4) and UC (4,4) , whereas one intra-VCA branch connects it to UC (3,4) . In summary, the intra-VCA branch connects the UCs in different tiers but the same VCA, whereas the inter-VCA branch connects the UCs in different tiers and different VCAs.…”

“…Various devices such as RF, analog, memory, and digital chips are mounted on the MPCBs. Digital devices are known to generate wideband electromagnetic noise in the gigahertz (GHz) frequency range, which severely degrades the performance of the other circuits including themselves [1][2][3][4][5]. In addition, the noise source and victim devices are placed closely for the compact design.…”

Broadband Green's Function With Low Wavenumber Extraction for Arbitrary Shaped Waveguide and Applications to Modeling of Vias in Finite Power/Ground Plane

“…The physical problem is that of TM modes in a cavity with PMC boundary conditions on the side walls. Various methods have been used for waveguide problem of arbitrary shape [1][2][3][4][5][6][7][8][9][10][11][12][13][14]. For example, analytical methods were developed for rectangular structures [3,4].…”