Designing low-thermal-expansivity, high-conductivity alloys in the Cu-Fe-Ni ternary system

Cottle, R.D.; Chen, X.; Jain, Reliance; Eliezer, Z.; Rabenberg, L.; Fine, M. E.

doi:10.1007/s11837-998-0132-x

Cited by 19 publications

(7 citation statements)

References 5 publications

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“…The combination of its low thermal expansion and its relatively high electrical and thermal conductivity makes Ni-Cu-Fe also an interesting candidate for the development of new data storage facilities [3].…”

Section: Nickel-copper-ironmentioning

confidence: 99%

Density and Surface Tension of Liquid Ternary Ni–Cu–Fe Alloys

2006

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The density and surface tension of liquid Ni-Cu-Fe alloys have been measured over a wide temperature range, including the undercooled regime. A non-contact technique was used, consisting of an electromagnetic levitator equipped with facilities for optical densitometry and oscillating drop tensiometry. At temperatures above and below the liquidus point, the density and surface tension are linear functions of temperature. The concentration dependence of the density is significantly influenced by a third-order (ternary) parameter in the excess volume. The surface tensions are rather insensitive to substitution of the two transition metals Ni, Fe against each other and depend only on the copper concentration. By numerically solving the Butler equation, the surface tension of the ternary system can be derived from the thermodynamic potentials E G of the binary phases (Ni-Cu, Fe-Cu, Ni-Fe) alone.

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Section: Nickel-copper-ironmentioning

confidence: 99%

Density and Surface Tension of Liquid Ternary Ni–Cu–Fe Alloys

2006

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“…[9][10][11][12] Microstructures of the Cu/Invar composites prepared by laminating and extruding are anisotropic. The casting temperature of the composites is so high that the reaction between the Invar alloy and Cu is severe.…”

Section: Introductionmentioning

confidence: 99%

Preparation of Cu/Invar composites by powder metallurgy

Yang

et al. 2014

Powder Metallurgy

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An orthogonal experiment scheme was employed to study the influences of forming pressure, sintering temperature and holding time and Cu content on microstructure, hardness and electrical resistivity of the Cu/Invar composites prepared by the powder metallurgy (PM) technique. The interdiffusion of the Fe, Ni and Cu atoms of the composites during sintering was also investigated. The results show that the Invar alloy is distributed continuously in the composites, when the Cu content is 30 wt-% and below; when the Cu content is 40 wt-% and above, a continuous net structure of Cu forms. Properties, especially the electrical and thermal conductivities, depend on the relative density and atom interdiffusion of the Cu/Invar composites. Taking the electrical resistivity of the composites as index, the optimum processing parameters are: forming pressure of 600 MPa, sintering temperature of 1000uC, holding time of 60 min and Cu content of 50 wt-%.

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“…Different approaches have been used in the past, including alloy design [1], novel MMCs [2][3][4][5] and laminated composites, to make materials with properties suitable for electronic packaging applications. Although laminates consisting of Cu/Mo/Cu and Cu/ Invar/Cu have been developed, via roll bonding, to reduce effective CTE, no reported attempts have been made so far to improve TC by surface modification.…”

Section: Introductionmentioning

confidence: 99%