Designing thermoelectric self-cooling system for electronic devices: Experimental investigation and model validation

Design and Manufacture of a Micro-Ejector and the Testing Stand for Investigation of Micro-Ejector Refrigeration Systems

“…Rakshith et al [12] summarized the application of heat pipes in cooling applications for electronic devices and also demonstrated their abilities to enable effective cooling under dynamic conditions. As an alternative to heat pipes, cooling demands can be met by thermoelectric devices [13][14][15]. Heat pipes can be integrated with an ejector; according to Riffat and Holt [16], such systems provide very efficient performance and maintain very small dimensions.…”

Performance evaluation of an automotive thermoelectric generator with a non-isometric distributed fin heat exchanger

“…In structure optimization, researchers have focused on structural improvement in three directions: heat sinks, [15][16][17][18] heat exchangers, [19][20][21][22] and thermoelectric modules (TEMs). [23][24][25][26][27] Since the heat exchanger is in direct contact with the hightemperature uid, its structural optimization can improve the efficiency of the TEG more directly and effectively.…”