“…13,14,15 SMPs thus present the advantage of being particularly environmentally and industrially attractive water-based and solvent-free adhesives for which shrinkage, typically encountered with solvent-based adhesives, hardly occurs upon curing. 16,17,18,19,20,21,22,23,24,25,26 The curing process of SMPs involves hydrolysis of the silyl alkoxide FG(s) which then results in the formation of cohesive siloxane (−Si−O−Si−) bonds, thus insuring the cross-linking of a liquid or gel pre-material into a 3D solid one, and assuring the cohesive adhesive joint providing the resistance of the assembly. 2,5,7,[13][14][15]21 Curing is a two-step process involving first the conversion of the alkoxysilane to silanol followed by the condensation of −Si−OH and −Si−OR to form siloxane linkages upon elimination of ROH (or by condensation of two −Si−OH accompanied with H 2 O abstraction) (Scheme 1).…”