2011
DOI: 10.1016/j.microrel.2011.07.021
|View full text |Cite
|
Sign up to set email alerts
|

Determination of bulk discharge current in the dielectric film of MEMS capacitive switches

Abstract: The present work presents a new method to calculate the discharge current in the bulk of dielectric films of MEMS capacitive switches. This method takes into account the real MEMS switch with non uniform trapped charge and air gap distributions. Assessment of switches with silicon nitride dielectric film shows that the discharge current transient seems to obey the stretched exponential law. The decay characteristics depend on the polarization field's polarity, a fact comes along with experimental results obtai… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1

Citation Types

0
20
0

Year Published

2012
2012
2017
2017

Publication Types

Select...
7

Relationship

0
7

Authors

Journals

citations
Cited by 16 publications
(20 citation statements)
references
References 17 publications
0
20
0
Order By: Relevance
“…Accordingly, characterization of the charging dynamics is an important issue that has been studied using different methods. For instance, in [2] iterative measurements of pull-in voltage have been used to monitor the charge evolution with time. However, this strategy alters the amount of trapped charge and is not compatible with normal operation of the devices.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Accordingly, characterization of the charging dynamics is an important issue that has been studied using different methods. For instance, in [2] iterative measurements of pull-in voltage have been used to monitor the charge evolution with time. However, this strategy alters the amount of trapped charge and is not compatible with normal operation of the devices.…”
Section: Introductionmentioning
confidence: 99%
“…The use of this type of models is appropiate since diffusion processes have been associated with dielectric charging in MEMS [5]. Furthermore, there is a link in [6] between fractional systems and the typically observed multiexponential or stretched-time exponential type responses [2], [7] usually found in dielectric charging.…”
Section: Introductionmentioning
confidence: 99%
“…This implies that an indirect measurement of the dielectric charge, Q n , is available at each sampling time nT S . This kind of measurement is insensitive to vertical shifts of the C-V that can be caused by charge inhomogeneity [18] or by changes in environmental factors such as temperature or humidity [19], [20]. Note that charge sensing is built-in with device actuation, so it is less invasive than other common methods used to detect the total charge, such as measuring V sh as the displacement of the pull-in voltage (which involves applying voltage stress to close the device and thus takes time and dramatically alters the charge status) or performing shortrange C-V measurements to detect the displacement of the minimum of the curve [21].…”
Section: Sigma-delta Control Of Dielectric Chargingmentioning
confidence: 99%
“…8,10 Dielectric charging of the intermetal dielectric of capacitive switches is most commonly studied; however, charging of the substrate layers in ohmic 12 and dielectricless capacitive 9 switches has also been reported. The evolution of pull-in voltage with stress time has been modeled by either exponential, 7 stretched exponential, [12][13][14] or power-law equations. 9,15 Both the pull-in and release voltages of capacitive switches can be simultaneously affected by mechanical degradation and dielectric charging.…”
mentioning
confidence: 99%
“…2 However, mechanical degradation in the form of air gap change can affect V Cmin measurements by changing the value of the minimum capacitance and therefore the calculated amount of charge. 4,13 The devices used in this work are shunt capacitive switches fabricated over co-planar waveguide structures. 16 The substrate was composed of high-resistivity silicon wafers with 2 lm thick initial oxide deposited by plasma enhanced chemical vapor deposition (PECVD).…”
mentioning
confidence: 99%