Determination of Exciton Binding Energy of GaInNAs Quantum Well Structures by Piezoelectric Photothermal Spectroscopy Compared with Photoreflectance Measurements

Epitaxial Growth of SrTiO3 Films on Cube-Textured Cu-Clad Substrates by PLD at Low Temperature Under Reducing Atmosphere

“…The copper content on nickel surface can affect the cube texture of epitaxial STO deposited or even some properties of layers deposited over STO, such as in the case of CC. In a previous research of Kashima et al [27], with the same Cu-clad substrate used in this work, they estimated the copper concentrations on nickel layer surface at different thicknesses of nickel and different temperatures and times. For a thermal treatment of 500 °C after 2 h with a Ni layer of 0.5 μm, the content of Cu on the surface is below 1% [27].…”

“…In a previous research of Kashima et al [27], with the same Cu-clad substrate used in this work, they estimated the copper concentrations on nickel layer surface at different thicknesses of nickel and different temperatures and times. For a thermal treatment of 500 °C after 2 h with a Ni layer of 0.5 μm, the content of Cu on the surface is below 1% [27]. Therefore, for Cu-clad samples used in this work with a 1 μm of Ni thickness and treated at 500 °C between 30 and 60 min, the final copper surface concentration is expected to be below 1% according to Kashima et al [27].…”

“…For a thermal treatment of 500 °C after 2 h with a Ni layer of 0.5 μm, the content of Cu on the surface is below 1% [27]. Therefore, for Cu-clad samples used in this work with a 1 μm of Ni thickness and treated at 500 °C between 30 and 60 min, the final copper surface concentration is expected to be below 1% according to Kashima et al [27]. For instance, it could be used for CC applications, since it can be stated that there is no effect on superconductivity if the Cu concentration rises up to 16.7% [27].…”

“…with low roughness and excellent mechanical properties. This clad is based on a rolling-assisted biaxially textured substrate (RABiTS) of cube-textured copper (30 μm) with a thin electroplated cube-textured nickel layer on it with a thickness of 1 μm, bonded to a stainless steel (SS) tape (80 μm) by surface activated bonding (SAB) technique [24, 27]. The detailed fabrication process has been described in a previous work [24].…”

“…The detailed fabrication process has been described in a previous work [24]. The main role of the nickel layer is to act as a barrier layer for copper diffusion and prevent the oxidation of the copper tape [27]. …”