Determination of mechanical, electrical and thermal properties of the Sn―Bi―Zn ternary alloy

Çadırlı, Emin; Böyük, Uğur; Kaya, Hasan; Maraşlı, Necmetti̇n

doi:10.1016/j.jnoncrysol.2011.03.025

Cited by 39 publications

(16 citation statements)

References 34 publications

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“…Experimental curves indicate that the highest tensile stress and lowest strain (%) values were observed for 8.35 µm/s. Similar behavior was obtained in the literature 19,20 for similar solidification condition.…”

Section: The Effect Of the Growth Rate On The Microhardness And Ultimsupporting

confidence: 91%

Determination of Microstructure, Mechanical, Electrical and Thermal Properties of The Directionally Solidified Al-Si-Co Ternary Alloy

Aker

Kaya

2016

Mat. Res.

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In this work, Al-12.6Si-2Co (wt.%) ternary alloy of near eutectic composition was directionally solidified at a constant temperature gradient (G=7.60 K/mm) in a wide range of growth rates (V=8.35-166.30 µm/s) using by Bridgman type growth apparatus. Flake spacing (λ), microhardness (HV), tensile stress (σ) and electrical resistivity (ρ) were measured from directionally solidified samples. The dependence of flake spacing, microhardness, tensile stress and electrical resistivity on growth rate (V) was also determined by statistical analysis. According to these results, it has been found that for increasing values of V, the values of HV, σ and ρ increase. Variations of electrical resistivity (ρ) for casting Al-Si-Co alloy were also measured at the temperature in range 300−500 K. The enthalpy of fusion (ΔH) for the Al-Si-Co alloy was determined by differential scanning calorimeter (DSC) from heating trace during the transformation from solid to liquid. The results obtained in this work were compared with the previous similar experimental results obtained for binary and ternary alloys.

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Section: The Effect Of the Growth Rate On The Microhardness And Ultimsupporting

confidence: 91%

Determination of Microstructure, Mechanical, Electrical and Thermal Properties of The Directionally Solidified Al-Si-Co Ternary Alloy

Aker

Kaya

2016

Mat. Res.

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“…It is worth noting that only one IMC layer formed in solder joint with time aging, and the grain layer is (Cu,Ni) 6 Sn 5 . However, usually, the IMCs layer compose two layers, and a stable layer which is Cu 3 Sn is between Cu substrate and (Cu,Ni) 6 Sn 5 layer, but, the Cu 3 Sn doesn't appear in the experiment. The result is very similar to other solder system in our latest experiment, and it will be reported soon.…”

Section: Resultsmentioning

confidence: 99%

“…At the aging stage, Cu atoms come from Cu substrate diffuse to the IMC layer, as (Cu,Ni) 6 Sn 5 phase is thermodynamic-cally unstable, it will react with Cu atom to form stable phase, proceeding as (Cu,Ni)6Sn5+ 9Cu→5Cu 3 Sn+6Ni. Unfortunately, Cu 3 Sn is harmful to the reliability of solder joints. It seems that the behavior of Cu 3 Sn during its growth is strongly dependent on the diffusion of the dominant reactive species and on the reaction pathway.…”

Section: Resultsmentioning

confidence: 99%

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Effect of Interval Aging Mode on IMC Growth between Low Ag Content Sn-0.3Ag-0.7Cu-0.5Bi-Ni and Cu Substrate

Qu¹,

Cui²,

Liu³

et al. 2018

Proceedings of the 4th Annual International Conference on Material Engineering and Application (ICMEA 2017)

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Abstract-To simulate the application environment of a number of electronic products, the growth of Sn-0.3Ag-0.7Cu-0.5Bi-Ni/Cu solder joints with low content of Ag was investigated during aging in an interval mode. It shows that the intermetallic compound (IMC) (Cu,Ni) 6 Sn 5 layer becomes thicker with increasing aging time. The growth of IMC (Cu,Ni) 6 Sn 5 layer during aging follows the diffusion control mechanism. Furthermore, it is demonstrated that there is no IMC Cu3Sn layer appear whatever increasing the aging time. It is explained the phenomenon is mainly attribute to the interval aging mode. According to kinetics, the activation energy is not high enough to overcome the energy obstacle due to the interval aging mode and finally the Cu3Sn phase doesn't form. Hence, the reliability of solder joints is improved.

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“…Qiu [5] researched the formation of intermetallic reaction layers and their influence on shear strength between the Zn-Sn-Cu-Bi (ZSCB) and Cu substrate during the liquid state reaction, results showed that reliable solder joints could be obtained at 450℃after 15-30 s of wetting. Çadırlı [6] studied the effect of temperature gradient and growth rate on the mechanical, electrical and thermal properties of the Sn-Zn-Bi eutectic alloy, result showed that the melting temperature of Sn-23 wt.% Bi-5 wt.% Zn alloy was detected to be 448.14 K. Hu [7] investigated the interfacial reactions between Cu and Sn-3.0Ag-0.5Cu (SAC305) solder reflowed under various cooling rates, the results verify that the Cu6Sn5 grains coarsened linearly with cubic root of aging time. Nishikawa [8] researched the formation and growth of an intermetallic compound (IMC) layer at the Sn-Ag-Cu solder/Cu interface after laser soldering and during isothermal aging, result showed that a relatively thin IMC layer is formed at the interface of the joints soldered by the laser process.…”

Section: Introductionmentioning

confidence: 99%

Effect of aging mode on the IMC growth of SAC(305)/Cu solder joints during aging

Cao

Cui

et al. 2018

Proceedings of the 2018 8th International Conference on Manufacturing Science and Engineering (ICMSE 2018)

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Abstract. Two different aging modes of continuous aging and interval aging were adopted to investigate the intermetallic compound (IMC) growth between Sn-3.0Ag-0.5Cu (SAC(305) )solder and Cu substrate. The morphologies of IMC layer are different during two different aging modes, and there is only one phase(Cu 6 Sn 5 phase) form during interval aging. Despite the different morphologies, the growth of IMC layers both follow diffusion control mode during two different aging styles, and the growth rate of IMC layer is slowlier over interval aging than that over continuous aging. In addition, it is illuminated the phenomenon of no Cu 3 Sn form during interval aging, this can be mainly explained by interval aging mode and diffusion growth mode, the free energy of system is not high enough to overcome the kinetic energy barrier and make the Cu 6 Sn 5 phase change into Cu 3 Sn. In a word, the reliability of SAC(305)/Cu solder joints can be improved during interval aging.

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Determination of mechanical, electrical and thermal properties of the Sn―Bi―Zn ternary alloy

Cited by 39 publications

References 34 publications

Determination of Microstructure, Mechanical, Electrical and Thermal Properties of The Directionally Solidified Al-Si-Co Ternary Alloy

Determination of Microstructure, Mechanical, Electrical and Thermal Properties of The Directionally Solidified Al-Si-Co Ternary Alloy

Effect of Interval Aging Mode on IMC Growth between Low Ag Content Sn-0.3Ag-0.7Cu-0.5Bi-Ni and Cu Substrate

Effect of aging mode on the IMC growth of SAC(305)/Cu solder joints during aging

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