2018
DOI: 10.1088/1361-6641/aaa908
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Determination of the band gap of indium-rich InGaN by means of photoacoustic spectroscopy

Abstract: Photoacoustic (PA) measurements have been performed on a series of In x Ga 1−x N thin films grown with x>50%. In order to illustrate the usefulness of this technique, these measurements have been compared with the results obtained by the following conventional techniques: photoluminescence, transmittance and contactless electroreflectance. Amongst all these techniques, only PA spectroscopy exhibited signal without the undesired Fabry-Perot interferences arising from the thin film and buffer layer. By accurat… Show more

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Cited by 8 publications
(4 citation statements)
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“…The inset of Figure 9b shows the graph of (Ahϑ)2 as a function of hϑ. The value of Eg was estimated by the extrapolation of the dotted line with the abscissa [31,32], as shown in the inset. The value of the corresponding Eg for MnSb 2 O 6 was of 1.79 eV.…”
Section: Resultsmentioning
confidence: 99%
“…The inset of Figure 9b shows the graph of (Ahϑ)2 as a function of hϑ. The value of Eg was estimated by the extrapolation of the dotted line with the abscissa [31,32], as shown in the inset. The value of the corresponding Eg for MnSb 2 O 6 was of 1.79 eV.…”
Section: Resultsmentioning
confidence: 99%
“…We can consider two phonon modes are noted at 567 cm −1 and 741 cm −1 which corresponds to E 2 high mode of GaN buffer layer and A 1 (LO) mode of InGaNlike, respectively [16]. For implanted samples, the alloy related broad band peak at about 696 cm −1 to 678 cm −1 is seen to be linearly dependent on the In content of InGaN epilayer [16] and it is correlated with the composition obtained from the HRXRD measurements and are in good agreement. It proposing that this Raman feature is most likely generated by In clustering.…”
Section: Resultsmentioning
confidence: 99%
“…where E g (InN) and E g (GaN) is 0.71 and 3.42 eV at 300 K. Bowing parameter b = 1.43 eV [16]. The material parameter used in this work are list in table 2 [17].…”
Section: Device Structures and Simulation Parametersmentioning
confidence: 99%