Determination of the coverage of an Au overlayer on an Ag island film using surface enhanced raman scattering

Liang, N. T.; Sheen, J.L.; Wang, Shou-Yih

doi:10.1016/0039-6028(88)90135-5

Cited by 1 publication

(1 citation statement)

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“…Some investigators use evaporation rate to reduce roughness . Substrate temperature during evaporation is another important variable. ,,,,, Metal film post-treatment is yet another strategy for enhancing smoothness. ,,, Thermal and chemical pre-treatments of the mica can all have influences on the roughness of the final, top surface of the gold. , A very thin underlayer metal, different from gold, can also be used to affect surface topography. ,,,,− The use of different substrate materials altogether (e.g., silicon, quartz, graphite) results in other morphological characteristics of the gold surface. ,,,,,− …”

Section: Introductionmentioning

confidence: 99%

Direct Force Measurements at the Smooth Gold/Mica Interface

1998

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We have developed a technique for accessing a very smooth gold surface (4 Å root-mean-square roughness) with nominal area greater than 100 μm2. It is a simple, controlled, and chemically noninvasive procedure of separating the smooth gold/mica interface carried out in the surface forces apparatus. Taking advantage of cold welding between surfaces of thin gold films and using carefully chosen quantities of compression, we have been able to isolate a region of the smooth gold/mica interface from forces other than those of adhesion. This allows measurement of the pull-off force required to separate smooth gold from mica (F p/R = 1800 mN/m); this represents a significant end point to data of previous studies addressing the impact of roughness on adhesion. Roughening of the gold surface during the separation process acts to reduce the pull-off forces required on subsequent separations.

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