Determination of the interfacial strength and fracture toughness of a-C:H coatings by in-situ microcantilever bending

Schaufler, Jens; Schmid, Christoph; Durst, Karsten; Göken, Mathias

doi:10.1016/j.tsf.2012.08.031

Cited by 59 publications

(27 citation statements)

References 29 publications

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“…Third, crack nucleation and propagation is strongly influenced by the presence of residual stresses, which can be high in thin ceramic films, thereby limiting the application of the method to films in which the residual stresses are accurately known by other techniques. 6,7 The main testing geometries are single [12][13][14][15] and double cantilever beams. 6,7 To address these issues, a number of innovative techniques has been developed relying on fabrication by focused ion beam milling (FIB) of micro-beams deformed using a nanoindenter.…”

Section: Introductionmentioning

confidence: 99%

“…6,7 To address these issues, a number of innovative techniques has been developed relying on fabrication by focused ion beam milling (FIB) of micro-beams deformed using a nanoindenter. [12][13][14] Jaya et al 15 successfully used this technique to extract the fracture toughness as a function of the temperature. 6,7 The main testing geometries are single [12][13][14][15] and double cantilever beams.…”

Section: Introductionmentioning

confidence: 99%

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Effects of indenter angle on micro‐scale fracture toughness measurement by pillar splitting

et al. 2017

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We present improvements to a recently developed pillar splitting technique that can be used to characterize the fracture toughness of materials at the micrometer scale. Micro-pillars with different aspect ratios were milled from bulk Si (100) and TiN and CrN thin films, and pillar splitting tests were carried out using four different triangular pyramidal indenters with centerline-to-face angles varying from 35.3Â° to 65.3Â°. Cohesive zone finite element modeling (CZ-FEM) was used to evaluate the effect of different material parameters and indenter geometries on the splitting behavior. Pillar splitting experiments revealed a linear relationship between the splitting load and the indenter angle, while CZ-FEM simulations provided the dimensionless coefficients needed to estimate the fracture toughness from the splitting load. The results provide novel insights into the fracture toughness of materials at small-scales using the pillar spitting technique and provide a simple and reliable way to measure fracture toughness over a broad range of material properties

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effects of indenter angle on micro‐scale fracture toughness measurement by pillar splitting

et al. 2017

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“…These cantilevers showed a constant stiffness level in both the elastic and plastic parts of the experiment. Further details are presented in the Appendix A (2).…”

Section: A Hard Oriented Stoichiometric Nialmentioning

confidence: 99%

“…Even at the micron and submicron length scale, various studies [1][2][3][4][5][6][7][8] have shown that versatile fracture experiments can be adequately evaluated. Rectangular beams with and without notches were prepared in diamond-like carbon coatings by Schaufler et al 2 to investigate the fracture toughness and the interface strength of their films with a thickness below 1 lm. Matoy et al 3 used a similar geometry and investigated among other things the fracture toughness of passivated silicon based thin films.…”

Section: Introductionmentioning

confidence: 99%

Fracture toughness evaluation of NiAl single crystals by microcantilevers—a new continuous J-integral method

et al. 2016

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The fracture toughness of NiAl single crystals is evaluated with a new method based on the Jintegral concept. The new technique allows the measurement of continuous crack resistance curves at the microscale by continuously recording the stiffness of the microcantilevers with a nanoindenter. The experimental procedure allows the determination of the fracture toughness directly at the onset of stable crack growth. Experiments were performed on notched microcantilevers which were prepared by focused ion beam milling from NiAl single crystals. Stoichiometric NiAl crystals and NiAl crystals containing 0.14 wt% Fe were investigated in the so-called "hard" orientation. The fracture toughness was evaluated to be 6.4 6 0.5 MPa m 1/2 for the stoichiometric sample and 7.1 6 0.5 MPa m 1/2 for the iron containing sample, indicating that the addition of iron enhances the ductility. This effect is intensified with ongoing crack propagation where the Fe-containing sample exhibits a stronger crack resistance behavior than the stoichiometric NiAl single crystal. These findings are in good agreement with macroscopic fracture toughness measurements, and validate the new micromechanical testing approach.

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“…While micro-pillar compression has been used to measure changes in Young's modulus, the required fracture toughness values cannot be assessed. In this study, micro-cantilever bending of focused ion beam (FIB) milled structures was performed, which had been proven to be a viable tool in order to characterize fracture toughness of individual phases and interfaces [17][18][19][20][21][22]. The fracture toughness of the hexagonal Cu 6 Sn 5 grains is tested parallel and perpendicular to their growth direction to determine a possible orientation influence on the fracture toughness with respect to typical loading directions within the solder joint.…”

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confidence: 99%

Fracture toughness of intermetallic Cu6Sn5 in lead-free solder microelectronics

et al. 2016

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Determination of the interfacial strength and fracture toughness of a-C:H coatings by in-situ microcantilever bending

Cited by 59 publications

References 29 publications

Effects of indenter angle on micro‐scale fracture toughness measurement by pillar splitting

Effects of indenter angle on micro‐scale fracture toughness measurement by pillar splitting

Fracture toughness evaluation of NiAl single crystals by microcantilevers—a new continuous J-integral method

Fracture toughness of intermetallic Cu6Sn5 in lead-free solder microelectronics

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