Determination of the Williams Series Expansion’s Coefficients Using Digital Photoelasticity Method and Finite Element Method

Abstract

In the present work, photoelastic and finite element methods have been employed to study the near crack tip fields in isotropic linear elastic cracked bodies under mixed mode loading. The investigated fracture results have been obtained for a series of cracked specimens by testing plates with two parallel cracks, two inclined parallel cracks, three-point bend specimens, four-point bend specimens, inclined edge crack triangular shape specimens subjected to symmetric three point bend loading. The multi-parameter Williams series expansion is used for the crack tip field characterization. Digital photoelasticity method is utilized for determination of the Williams series expansion’s coefficients. The unknown coefficients in the multi-parameter equation are determined using a linear least squares method in an over-deterministic manner. Together with the experimental determination of the fracture mechanics parameters finite element method is invoked to describe the crack tip stress field. Coefficients of higher order terms are either found numerically by finite element method. A good agreement is found between the numerical and experimental results. The significant advantages using multi-parameter equations in the analysis of the stress field are shown and the errors that a study with a limited number of terms produce is demonstrated. The comparison with finite element analysis highlighted the importance and precision of the photoelastic observation for the evaluation of the fracture mechanics parameters. The experimental SIF, T-stress values and coefficients of higher-order terms estimated using the digital photoelasticity method for the extensive series of cracked specimens are compared with finite element analysis (FEA) results, and are found to be in good agreement.