Determination of thermal diffusivity and thermal conductivity of Mg–Al alloys

Rudajevová, A.; Staněk, M.; Lukáč, P.

doi:10.1016/s0921-5093(02)00233-2

Cited by 111 publications

(41 citation statements)

References 7 publications

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“…The λ e obtained for OFHC copper and Cu-Cr-Zr-Ti alloy was 398 Wm −1 K −1 and 248 Wm −1 K −1 , respectively, which clearly shows that λ e for the alloy is suppressed due to alloying elements. This result is in line with that obtained for MgSc alloys, where it was reported that significant change has been noticed in λ e with the concentration of the alloying element added to the alloy [14,15].…”

Section: Resultssupporting

confidence: 92%

“…However, the gap between the curves was more at room temperature, and it diminished with increase in temperature. A similar increasing trend of thermal conductivity with temperature was reported in copper alloys [9,10], platinum alloys [12], tungsten alloys [13], and magnesium alloys [14,15]. The reason for lower thermal conductivity for alloys can be attributed to the alloying elements added to the matrix.…”

Section: Resultssupporting

confidence: 75%

“…It is seen from the Figure 1 that the thermal conductivity of Cu-Cr-Zr-Ti alloy increases with temperature up to 873 K. The reason for such increasing trend to a larger extent may be attributed to the increase in electronic thermal conductivity with temperature [13][14][15]. Nevertheless, some contribution can be ascribed to microstructural changes occurring in the specimen during the test.…”

Section: Resultsmentioning

confidence: 94%

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Thermal Conductivity of Cu-Cr-Zr-Ti Alloy in the Temperature Range of 300–873 K

et al. 2012

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In the present investigation, thermal conductivity of Cu-Cr-Zr-Ti alloy was determined as the product of the specific heat (C p ), thermal diffusivity (α), and density (ρ) in the temperature range of 300-873 K. The experimental results showed that the thermal conductivity of the alloy increased with increase in temperature up to 873 K and the data was accurately modeled by a linear equation. For comparison, thermal conductivity was also evaluated for OFHC copper in the same temperature range. The results obtained were discussed using electrical conductivity and hardness measurements made at room temperature. Transmission electron microscopy (TEM) was done to understand the microstructural changes occurring in the sample after the test. Wiedemann-Franz-Lorenz law was employed for calculating electronic and phonon thermal conductivity using electrical conductivity. On the basis of studies conducted it was deduced that in situ aging may be one of the reasons for the increase in thermal conductivity with temperature for Cu-Cr-Zr-Ti alloy.

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Section: Resultssupporting

confidence: 92%

Section: Resultssupporting

confidence: 75%

Section: Resultsmentioning

confidence: 94%

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Thermal Conductivity of Cu-Cr-Zr-Ti Alloy in the Temperature Range of 300–873 K

et al. 2012

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“…Comparing the binary Mg-Al phase diagram and concentration distribution of Mg and Al atoms, intermetallic compounds MgAl, Mg 3 Al 2 , and Mg 2 Al 3 may be formed during the diffusion bonding. [11,12] …”

Section: Xrd and Epma Analysismentioning

confidence: 99%

Microstructure and phase constituents in the interface zone of Mg/Al diffusion bonding

Liu

Wang

et al. 2006

Metall Mater Trans B

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The microstructure and phase constituent for the Mg/Al diffusion-bonded joint were studied via scanning electron microscope (SEM), microhardness test, electron probe microanalyzer (EPMA), and X-ray diffraction (XRD). The test results indicated that the new compact phase was formed near the transition region of the Mg/Al diffusion interface. There are three new phase layers in the transition region. The microhardness of the diffusion zone is higher than that of the Mg and Al substrate. The fracture morphology mainly consists of a coarse and gray fracture, and the fracture is mainly the mixed fracture of cleavage and intergranular. X-ray diffraction tests indicate that the diffusion zone of the Mg/Al diffusion-bonded joint consists of intermetallic compounds MgAl, Mg 3 Al 2 , and Mg 2 Al 3 . With the increase of temperature, the content of Mg 3 Al 2 and Mg 2 Al 3 phases with good stability was increased.

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“…The thermal conductivity k and the electrical resistivity q are related according to the Wiedeman-Franz-Lorenz law. [19,20,21] …”

Section: Thermal Conductivitymentioning

confidence: 99%

Alloy Thermal Physical Property Prediction Coupled Computational Thermodynamics with Back Diffusion Consideration

Guo

Samonds

2007

J Phs Eqil and Diff

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Simulation technologies are applied extensively in casting industries to understand the heat transfer and fluid transport phenomena and their relationships to the microstructure and the formation of defects. It is critical to have accurate thermo-physical properties as input for reliable simulations of the complex solidification and solid phase transformation processes. The thermo-physical properties can be calculated with the help of thermodynamic calculations of phase stability at given temperatures and compositions. A multicomponent alloy solidification model, coupled with a Gibbs free energy minimization engine and thermodynamic databases, has been developed. A back diffusion model is integrated so that the solidification conditions, such as cooling rate, can be taken into account.

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Determination of thermal diffusivity and thermal conductivity of Mg–Al alloys

Cited by 111 publications

References 7 publications

Thermal Conductivity of Cu-Cr-Zr-Ti Alloy in the Temperature Range of 300–873 K

Thermal Conductivity of Cu-Cr-Zr-Ti Alloy in the Temperature Range of 300–873 K

Microstructure and phase constituents in the interface zone of Mg/Al diffusion bonding

Alloy Thermal Physical Property Prediction Coupled Computational Thermodynamics with Back Diffusion Consideration

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