Determination of thermal stress distribution in a model microelectronic device encapsulated with alumina filled epoxy resin using fluorescence spectroscopy

Muraki, Naoki; Matoba, Nobuhiro; Hirano, Takayuki; Yoshikawa, Masanobu

doi:10.1016/s0032-3861(01)00691-7

Cited by 21 publications

(13 citation statements)

References 24 publications

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“…In other words, the alumina ller was introduced into the system as a sensor for residual stress detection in microscopic regions. The feasibility of this stress-analysis method was already shown in a previous work; 24 however, it is the purpose of this report to apply this technique to a practical microelectronic package, which means m inimizing the amount of m ixed alumina powder to ,5 wt % of the whole compound. Preliminary calibrations in four-point bending were perform ed in order to precisely obtain the correlation between uorescence peak shift and stress for alumina embedded in epoxy resin, the same m aterial used for lm-based ball grid array (F-BGA) semiconductor devices.…”

Section: Introductionmentioning

confidence: 86%

Residual Stress Mapping of Epoxy Molding Compound in a Ball Grid Array Microelectronic Package Using a Fluorescent Sensor

et al. 2004

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Thermal residual stresses developed at the time of semiconductor molding may cause serious problems both in their structural and functional performance; therefore, residual stress assessment in microelectronic devices is a mandatory evaluation step. Fluorescence piezo-spectroscopy was applied to evaluate residual stresses with a microscopic resolution inside a semiconductor encapsulant. In order to obtain reliable stress information, a low fraction of alumina powder, as a fluorescent sensor, was embedded into the silica/epoxy molding compound. Residual stress was transferred from the molding compound to the alumina phase and could be monitored by recording the shift of the sharp and intense fluorescence spectrum of Cr3+ in alumina. Two-dimensional residual-stress maps, recorded near the edge of the silicon chip, revealed a strong stress concentration in the molding compound. Experimental results were compared with calculations obtained by the linear finite element method. Such a comparison showed that the experimental stress values were systematically larger than the corresponding calculated values due to local delamination at the chip edge.

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Section: Introductionmentioning

confidence: 86%

Residual Stress Mapping of Epoxy Molding Compound in a Ball Grid Array Microelectronic Package Using a Fluorescent Sensor

et al. 2004

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“…To evaluate the local stress distribution in a bulk sample, precise accuracy is paramount; hence, a fundamental investigation of measurement precision was performed as described in this report. In previous reports aimed at measuring the stress distribution of bulk samples, a PbO thin film as a Raman active material was coated on an epoxy resin, or an alumina particle as a tracer for detecting the stress was mixed with the epoxy resin, and the peak shift derived from the alumina tracer was measured . However, this method may be problematic in that the physical properties of the resin may be changed by mixing in an inorganic filler with a different hardness .…”

Section: Introductionmentioning

confidence: 99%

Raman imaging of residual stress distribution in epoxy resin and metal interface

Abiko

Kato

Hohjo

et al. 2019

J Raman Spectroscopy

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A method for the distribution analysis of residual stress in epoxy resins by Raman microspectroscopy was developed. By using the uniaxial tensile method, a negative correlation between the peak shift of the aromatic C─H stretching vibration and external stress was obtained. By optimizing the precision of the Raman shift measurement, a reliable stress image was obtained for a bulk epoxy resin. This method was applied to the evaluation of the residual stress distribution in epoxy resin/aluminum bonded materials. Raman spectra imaging revealed that stress concentration strongly occurred in the interface of the cured epoxy resin with aluminum, and it was found that Raman spectra images of the small residual stress of the resin interface were affected by the curing process and physical properties of the epoxy resin. Therefore, Raman spectra imaging would appear to have significant potential as a technique for the evaluation of local thermal residual stress in the interface of multimaterial structures. K E Y W O R D Sadhesion interface, epoxy resin, stress distribution, thermal residual stress

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“…Indeed, absolute pressures were obtained by integrating the bulk modulus determined via Brillouin spectroscopy with respect to volumes measured simultaneously by X-ray diffraction. The same technique can be used to measure temperature from the stress-induced shifts of the characteristic R-line peaks present in the emission spectrum of alumina as applied to alumina-epoxy composites to determine the thermal stress distribution of encapsulated microelectronic devices [ 9 ]. However, with these techniques, only one parameter, either pressure or temperature, is measured.…”

Section: Introductionmentioning

confidence: 99%

Pressure and Temperature Sensors Using Two Spin Crossover Materials

Jureschi

Linarès

Boulmaali

et al. 2016

Sensors

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The possibility of a new design concept for dual spin crossover based sensors for concomitant detection of both temperature and pressure is presented. It is conjectured from numerical results obtained by mean field approximation applied to a Ising-like model that using two different spin crossover compounds containing switching molecules with weak elastic interactions it is possible to simultaneously measure P and T. When the interaction parameters are optimized, the spin transition is gradual and for each spin crossover compounds, both temperature and pressure values being identified from their optical densities. This concept offers great perspectives for smart sensing devices.

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Determination of thermal stress distribution in a model microelectronic device encapsulated with alumina filled epoxy resin using fluorescence spectroscopy

Cited by 21 publications

References 24 publications

Residual Stress Mapping of Epoxy Molding Compound in a Ball Grid Array Microelectronic Package Using a Fluorescent Sensor

Residual Stress Mapping of Epoxy Molding Compound in a Ball Grid Array Microelectronic Package Using a Fluorescent Sensor

Raman imaging of residual stress distribution in epoxy resin and metal interface

Pressure and Temperature Sensors Using Two Spin Crossover Materials

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