2008
DOI: 10.1007/s10765-008-0378-0
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Determination of Transient Thermal Interface Resistance Between Two Bonded Metal Bodies using the Laser-Flash Method

Abstract: The paper presents the data reduction analysis for measurements of the transient thermal interface resistance between two bonded metal bodies using the laser-flash method. By using two different mathematical models, i.e., a two-layered and a three-layered model, whose complete analytical solutions for realistic conditions are provided, different results for final values and their uncertainties can be obtained. The analysis has been applied to experimental data measured from samples prepared with three differen… Show more

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Cited by 18 publications
(2 citation statements)
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“…A temperature discontinuity was found at the boundary between copper and liquid helium while a heat flux was passing through the interface. So far, the interfacial thermal resistance has been extensively studied using both theoretical models [6][7][8][9][10][11][12][13][14][15][16][17] and experimental methods [18][19][20][21][22][23][24][25][26][27][28]. Relevant theoretical models for the solid-liquid interfacial thermal resistance have been established based on the surface morphology and solid-liquid contact mechanisms.…”
Section: Introductionmentioning
confidence: 99%
“…A temperature discontinuity was found at the boundary between copper and liquid helium while a heat flux was passing through the interface. So far, the interfacial thermal resistance has been extensively studied using both theoretical models [6][7][8][9][10][11][12][13][14][15][16][17] and experimental methods [18][19][20][21][22][23][24][25][26][27][28]. Relevant theoretical models for the solid-liquid interfacial thermal resistance have been established based on the surface morphology and solid-liquid contact mechanisms.…”
Section: Introductionmentioning
confidence: 99%
“…Later extensions to the method provided the possibility of measurements in high temperatures [23,24]. Its application for the evaluation of unknown thermal parameters in two-and three-layered solid structures was also proposed [25][26][27][28][29]. In the most advanced and popular variant [28], the measurement of thermal contact resistance between layers and/or unknown thermal diffusivity of one of the layers is possible.…”
Section: Introductionmentioning
confidence: 99%