Determination of Young’s Modulus of Tensile Specimen for Lead-Free Solder

Abstract

Abstract. In terms of geometry, various types of solder samples have been used in the literature to perform tensile experiment to investigate the mechanical behaviour of solder materials. Most of the studies focused on the plastic behaviour under complicated service environment. Nevertheless, there was usually no such a detailed description about Young's modulus due to the softness of solder material. In this paper, the disadvantages of existing experimental approaches to measure Young's modulus is discussed. In order to properly evaluate the magnitude of Young's modulus, finite element simulations are conducted for the dog-type tensile specimens which have been widely adopted for tension testing of metallic materials. Based on the elastic stage response, the Young's modulus can be corrected based on the proposed relationship between overestimated ratio of displacement and clamped length. Similarly, the Young's modulus of different types of tensile specimens can be assessed and corrected. This finite element-based approach can overcome the dramatic deformation at localized yielding positions along the gauge length when the applied stress is greater than the yield strength of solder material. More importantly, the correction does not influence the yielding and hardening stages.