Determining the constitutive behavior of nonlinear visco-elastic-plastic PMMA thin films using nanoindentation and finite element simulation

Li, Hongzhou; Chen, Jialian; Chen, Qinghua; Liu, Ming

doi:10.1016/j.matdes.2020.109239

Cited by 29 publications

(7 citation statements)

References 24 publications

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“…Sample i (Cu/PI) serves as a reference, and its ε̅ value is 1.00. Poly(methyl methacrylate) (PMMA) and Cr were chosen as interlayers for Sample ii (Cu/PMMA/PI) and Sample iii (Cu/Cr/PI), respectively, because they are widely used as interfacial materials in many electronic devices yet exhibit significant differences in the elasto-plastic properties. − PMMA represents a soft ( E = 4.2 ± 0.8 GPa) yet elastic interlayer (ε Y = 3.4%), while Cr represents a stiff ( E = 265 ± 15 GPa) yet brittle interlayer (ε Y = 0.9%). The ε̅ values of Samples ii and iii are 0.97 and 1.01, respectively.…”

Section: Resultsmentioning

confidence: 99%

Elasto-Plastic Design of Ultrathin Interlayer for Enhancing Strain Tolerance of Flexible Electronics

Guo

Zhang

et al. 2023

ACS Nano

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The ability to tolerate large strains during various degrees of deformation is a core issue in the development of flexible electronics. Commonly used strategies nowadays to enhance the strain tolerance of thin film devices focus on the optimization of the device architecture and the increase of bonding at the materials interface. In this paper, we propose a strategy, namely elasto-plastic design of an ultrathin interlayer, to boost the strain tolerance of flexible electronics. We demonstrate that insertion of an ultrathin, stiff (high Young’s modulus) and elastic (high yield strain) interlayer between an upper rigid film/device and a soft substrate, regardless of the substrate thickness or the interfacial bonding, can significantly reduce the actual strain applied on the film/device when the substrate is bent. Being independent of existing strategies, the elasto-plastic design strategy offers an effective method to enhance the device flexibility without redesigning the device structure or altering the material interface.

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Section: Resultsmentioning

confidence: 99%

Elasto-Plastic Design of Ultrathin Interlayer for Enhancing Strain Tolerance of Flexible Electronics

Guo

Zhang

et al. 2023

ACS Nano

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“…Thus, one need not be surprised that even though O&P only made mention of thin-film mechanics in 1992, to identify motivations for nanoindentation research and development, the OP method of analysis emerged as a standard nanoindentation load-displacement data analysis framework that became [15], and remains [16], commonly applied to thin films. Nevertheless, as noted by Saha and Nix a decade after O&P's 1992 article, O&P formulated the OP method using monolithic materials, i.e., non-composite-like components [17].…”

Section: Needs Addressed By the Oliver-pharr Methodsmentioning

confidence: 99%

Toward an Instrumented Strength Microprobe – Origins of the Oliver-Pharr Method and Continued Advancements in Nanoindentation: Part 1

Sousa¹,

Hay²,

Cote³

2023

Elasticity of Materials

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Sub-micron instrumented indentation testing and standardized nanoindentation testing systems have become commonplace within the materials engineering community. Though commonly utilized for mechanical characterization, general appreciation and understanding of the governing theory, formulations and best practices underpinning modern nanoindentation systems appears to remain relatively elusive to the general materials science and engineering community as well as nanoindentation practitioners using such systems for mechanical assessment. Accordingly, the present chapter details how nanoindentation methods emerged and how the Oliver-Pharr method of nanoindentation testing and analysis was constructed and refined to yield theoretically consistent and readily implementable attributes for probing small-scale mechanical properties via microscopy free indentation testing.

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“…tensile properties [28], creep behavior [29], low-cycle fatigue [30,31], residual stress [32], and fracture toughness [33,34]) of various materials (e.g., metals [35], glasses [36], metallic glasses [37], ceramics [7,38], polymers [39][40][41], piezoelectric materials [42][43][44][45], thin films [46][47][48][49], and composites [50]). Microscratch test is also an effective technique to investigate scratch resistance of material [51], the structural integrity of multilayer coatings [52], tribological behavior [53,54], contact-induced damage/cracking [55], scratch-induced buckling failure of silicon nitride ceramic films [56], and the scratch behavior of Ce-doped YAG (Yttrium aluminum garnet, Y3Al5O12) coatings [57].…”

Section: Introductionmentioning

confidence: 99%

“…(42), and thus the relation between max h * and * f can be obtained with Eq. (38), and finally KC can be expressed as a function of * f with Eq (41)…”

mentioning

confidence: 99%

Micromechanical characterization of microwave dielectric ceramic BaO–Sm₂O₃–5TiO₂by indentation and scratch methods

Liu¹,

Xu²

2023

Journal of Advanced Ceramics

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Mechanical characterization of dielectric ceramics, which have drawn extensive attention in wireless communication, remains challenging. Micromechanical properties with microstructures of dielectric ceramic BaO-Sm2O3-5TiO2 (BST) were assessed by nanoindentation, microhardness, and microscratch tests under different indenters, along with X-ray diffraction, scanning electron microscopy, and Raman spectroscopy. Accurate determination of elastic modulus (i.e., 260 GPa) and indentation hardness (i.e., J u s t A c c e p t e d 16.2 GPa) of brittle BST ceramic by instrumented indentation technique requires low loads with little indentation-induced damage. Elastic modulus and indentation hardness were analyzed by different methodologies such as energybased and displacement-based approaches, and elastic recovery of Knoop imprint. Consistent values (about 3.1 MPa·m 1/2 ) of fracture toughness of BST ceramic were obtained by different methods such as Vickers indenter-induced cracking method, energy-based nanoindentation approaches, and linear elastic fracture mechanics-based scratch approach with a spherical indenter, demonstrating successful applications of indentation and scratch methods in characterizing fracture properties of brittle solids. The deterioration of elastic modulus or indentation hardness with the increase in indentation load is caused by indentation-induced damage, and can be used to determine fracture toughness of material by energy-based nanoindentation approaches, and the critical void volume fraction is 0.27 (or 0.18) if elastic modulus (or indentation hardness) of the brittle BST ceramic is used. The fracture work at the critical load corresponding to the initial decrease in elastic modulus or indentation hardness can also be used to assess fracture toughness of brittle solids, opening new venues of application of nanoindentation test as a means to characterize fracture toughness of brittle ceramics.

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Determining the constitutive behavior of nonlinear visco-elastic-plastic PMMA thin films using nanoindentation and finite element simulation

Cited by 29 publications

References 24 publications

Elasto-Plastic Design of Ultrathin Interlayer for Enhancing Strain Tolerance of Flexible Electronics

Elasto-Plastic Design of Ultrathin Interlayer for Enhancing Strain Tolerance of Flexible Electronics

Toward an Instrumented Strength Microprobe – Origins of the Oliver-Pharr Method and Continued Advancements in Nanoindentation: Part 1

Micromechanical characterization of microwave dielectric ceramic BaO–Sm₂O₃–5TiO₂by indentation and scratch methods

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Determining the constitutive behavior of nonlinear visco-elastic-plastic PMMA thin films using nanoindentation and finite element simulation

Cited by 29 publications

References 24 publications

Elasto-Plastic Design of Ultrathin Interlayer for Enhancing Strain Tolerance of Flexible Electronics

Elasto-Plastic Design of Ultrathin Interlayer for Enhancing Strain Tolerance of Flexible Electronics

Toward an Instrumented Strength Microprobe – Origins of the Oliver-Pharr Method and Continued Advancements in Nanoindentation: Part 1

Micromechanical characterization of microwave dielectric ceramic BaO–Sm2O3–5TiO2by indentation and scratch methods

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Product

Resources

About

Micromechanical characterization of microwave dielectric ceramic BaO–Sm₂O₃–5TiO₂by indentation and scratch methods