2021
DOI: 10.1016/j.tsep.2021.100958
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Developing a thermoelectric cooling module for control temperature and thermal displacement of small built-in spindle

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Cited by 13 publications
(7 citation statements)
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“…However, for the control of thermoelectric systems, in addition to reliability indicators, dynamic characteristics are also important, the relationship of which was not considered in the cited sources [11]. It is known that the dynamics unambiguously negatively affects the reliability indicators, which is a fundamental problem [12], in particular, linear thermal expansion of the materials of thermoelements and the substrate leads to cracking of the junctions [13]. In [14], the connection of dynamic indicators with the TEC design is shown, in [15] with the number of thermoelements, in [16] with the current modes of operation of the product, but only for one single-stage cooler.…”
Section: Literature Reviewmentioning
confidence: 99%
“…However, for the control of thermoelectric systems, in addition to reliability indicators, dynamic characteristics are also important, the relationship of which was not considered in the cited sources [11]. It is known that the dynamics unambiguously negatively affects the reliability indicators, which is a fundamental problem [12], in particular, linear thermal expansion of the materials of thermoelements and the substrate leads to cracking of the junctions [13]. In [14], the connection of dynamic indicators with the TEC design is shown, in [15] with the number of thermoelements, in [16] with the current modes of operation of the product, but only for one single-stage cooler.…”
Section: Literature Reviewmentioning
confidence: 99%
“…The inclusion of TEC in the control loop extends the intellectual capabilities of thermal mode support systems, but the dynamic characteristics important for control have not even been considered [11]. The importance of this problem in relation to reliability in thermal devices is that as switching frequency increases, reliability performance decreases [12]. The difference in the linear temperature expansions of the substrate material and thermocouple branches leads to junction cracking [13].…”
Section: Literary Reviewmentioning
confidence: 99%
“…At the same time, the control function requires knowledge of dynamic characteristics, which were not considered in the noted sources [11]. However, increasing the dynamic characteristics leads to decreasing the reliability performance, which is a fundamental problem [12]. For thermoelectric coolers, this is reflected in the fact that the linear thermal expansion of thermocouple and substrate materials leads to cracking of junction sites [13].…”
Section: Literature Reviewmentioning
confidence: 99%