In order to scale mechanical properties from molecular structures using coarse-grained methods, strategies must be developed to help the investigator that allows prediction not only of the initial modulus (operating in the pure elastic region of response) but also of the entire mechanical response; i.e., prediction in how the material fails with composition. The current chapter investigates methods to obtain the full stress-strain curve to failure for a copper oxide-epoxy interface which includes both smooth and rough interfaces, moisture, and the effect of filler, using coarse-grained methods. Of interest, is the ability to use coarse-graining to jump length scales by using bead units larger than functional groups; the ability of these models to discern changes in composition (such as crosslink density, moisture and filler), and the interesting trend of adhesion with interfacial roughness (which has been likened to a Hall-Petch effect). The use of coarse-grained models will be very useful to bridge scales, but will depend upon the ability to derive and apply the correct parameterization of the beads.