2012
DOI: 10.1016/j.microrel.2012.03.014
|View full text |Cite
|
Sign up to set email alerts
|

Developing the stress–strain curve to failure using mesoscale models parameterized from molecular models

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1

Citation Types

0
9
0

Year Published

2014
2014
2022
2022

Publication Types

Select...
4
1

Relationship

1
4

Authors

Journals

citations
Cited by 9 publications
(10 citation statements)
references
References 10 publications
0
9
0
Order By: Relevance
“…From these examples, it appears that a bond breaking criterion is needed for simulations which qualitatively match expected reality. Previous studies [36][37][38] used perfectly flat copper oxide-epoxy interfaces, however in reality materials, do not exhibit perfect flatness [1,42], so one question that arises is whether the effect of roughness can be captured using the same coarsegraining method. In order to approach the interface roughness question, in relationship to how the polymer may be coupled into the adhesive interface [43][44][45][46][47][48], the polymer structure was fixed at the highest crosslink case studied previously [36][37][38] (all epoxies reacted with a phenolic unit from bisphenol A) and only the copper oxide-polymer interface was considered.…”
Section: Developing the Stress-strain To Failurementioning
confidence: 99%
See 4 more Smart Citations
“…From these examples, it appears that a bond breaking criterion is needed for simulations which qualitatively match expected reality. Previous studies [36][37][38] used perfectly flat copper oxide-epoxy interfaces, however in reality materials, do not exhibit perfect flatness [1,42], so one question that arises is whether the effect of roughness can be captured using the same coarsegraining method. In order to approach the interface roughness question, in relationship to how the polymer may be coupled into the adhesive interface [43][44][45][46][47][48], the polymer structure was fixed at the highest crosslink case studied previously [36][37][38] (all epoxies reacted with a phenolic unit from bisphenol A) and only the copper oxide-polymer interface was considered.…”
Section: Developing the Stress-strain To Failurementioning
confidence: 99%
“…The entire novolac epoxy plus its' bisphenol A curative represented one bead, as described previously [36]. As before with the perfectly smooth interfaces [36][37][38], the polymer was incrementally compacted onto the Cu 2 O bead surface in order to attain a global minimum before the interfaces were separated by incrementally moving the Cu 2 O layer into the vacuum space.…”
Section: Rough Copper Oxide-epoxy Interface Casesmentioning
confidence: 99%
See 3 more Smart Citations