Development and Challenges of Thermal Interface Materials: A Review

Yuan, Zhenye; Ma, Haoqi; Hussien, Mohammed A.; Feng, Yakai

doi:10.1002/mame.202100428

Cited by 30 publications

(9 citation statements)

References 136 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Boron Nitride (BN) is a popular filler with a wide band gap and high thermal conductivity [10]. Studies showed that BN fillers with appropriate doping parameters could enhance the electrical insulation [11], thermal conductivity [12,13], mechanical strength and chemical stability of polymer materials [14,15]. The modification effect has been verified in different types of polymer matrices such as cellulose, epoxy resin, polyethylene and polyimide.…”

Section: Introductionmentioning

confidence: 99%

Effect of organophilic group of coupling agent on the electrical performance of Boron Nitride/meta‐aramid composite paper

et al. 2022

View full text Add to dashboard Cite

Organophilic groups of coupling agents can be the key factor for the electrical performance of Boron Nitride (BN)/meta‐aramid composite paper. In this article, four types of triethoxy‐silane coupling agents with different organophilic groups, including mercapto‐propyl (MP), glycidylether‐propyl (GP), amino‐propyl (AP) and trideca‐fluoro‐octyl (TFO) were studied. The structural and electrical properties of modified papers were compared, and the molecular simulation was conducted to reveal the interface interaction of modified BN and aramid. The results show that AP, GP and MP follow the same mechanism, improving the electrical performance by modifying the interface stability and paper structure, and the ranks of improving effects are AP, MP and GP. While, TFO mainly relies on the fluorine components to implement the electrical reinforcement, which compensates for the shortcoming in the paper structure. By choosing TFO and filler content of 15 wt%, the optimal breakdown strength of the paper can be increased to 28.17 kV/mm, 1.8 times that of the paper doped with the hydroxylated BN.

show abstract

Section: Introductionmentioning

confidence: 99%

Effect of organophilic group of coupling agent on the electrical performance of Boron Nitride/meta‐aramid composite paper

et al. 2022

View full text Add to dashboard Cite

show abstract

“…The thermal stability depends on the filler type, shape, size, defect, load rate, surface roughness, and the interactions between the filler and polymer matrix. 14,59,60 Some fillers can chemically interact with the functional groups of PVA, leading to covalent or intermolecular hydrogen bonding interactions, which can strengthen PVA matrices and improve the stability of the composite material under thermal stress (Figure 2). Although noncovalent bonds are not strong as covalent bonds, they can still significantly influence the properties and behaviors of PVA.…”

Section: Mechanism Of Thermal Degradationmentioning

confidence: 99%

Recent advances and challenges in thermal stability of PVA‐based film: A review

Suleiman,

Zeng,

Chakma

et al. 2024

Polymers for Advanced Techs

Self Cite

View full text Add to dashboard Cite

Food packaging film is being developed using biodegradable polymers to prolong the shelf life of foods and address the environmental damage caused by non‐biodegradable plastics. Poly(vinyl alcohol) (PVA) is a biodegradable polymer with outstanding characteristics and can be easily shaped into a film. However, PVA‐based film still faces several obstacles that seriously restrict its practical application in the food packaging industry, particularly its low thermal stability limits the film process method. The growing preference demand for PVA‐based films with enhanced thermal stability in food packaging can be attributed to their advantageous characteristics, including commendable temperature resistance, safety, versatile processing capabilities, and prolonged shelf life. It is critical to comprehend the difficulties with PVA thermal degradation behavior and mechanism, and how to address this problem. In this review, we provide strategies for improving the thermal stability of PVA film including modification with environmentally friendly polymers, nanoparticles, and crosslinking agents. Also, the current challenges, and the potential for future advancements in the thermal stability of PVA and its composites are proposed. The new insight into the relationship between PVA based film processing and thermal properties of materials are expected to provide a valuable guide for developing PVA films with high thermal stability.

show abstract

“…Balancing the contradiction between thermal conductivity and viscoelasticity has become the key problem in the development of TIMs. Most of the literatures about TIMs mainly focus on promoting their thermal conductivity while systematic studies on their rheological behaviors are still scarce 8–11 . Before curing, TIMs always experience a large deformation which controls its minimal thickness which has great influence on the contact thermal resistance.…”

Section: Introductionmentioning

confidence: 99%

“…Most of the literatures about TIMs mainly focus on promoting their thermal conductivity while systematic studies on their rheological behaviors are still scarce. [8][9][10][11] Before curing, TIMs always experience a large deformation which controls its minimal thickness which has great influence on the contact thermal resistance. Therefore, understanding the non-linear rheological behavior of TIMs has great significances for practical use.…”

mentioning

confidence: 99%

Strain controlled shear hardening behavior in suspensions of alumina spheres in a polydimethylsiloxane oligomer matrix

Wang

et al. 2023

Polymers for Advanced Techs

View full text Add to dashboard Cite

As a model system for thermal interface materials (TIMs), the complex rheological behavior of polydimethylsiloxane oligomer (oDMS)/alumina sphere particles (AlS) suspensions (i.e., oDMS/AlS) is investigated systematically in this work. Aluminum particles with 1 and 10 μm were used as fillers. Here, a surface treatment by using a silane coupling agent as found to be effective in improving the fluidity of the suspensions with small sized AlS particles. Peculiar large amplitude oscillatory shear (LAOS) results were observed for the suspensions that exhibited three or four responses (Hookean regime, shear softening, shear hardening and a second shear softening) depending on the surface properties of AlS particles. For the oDMS/AlS10 neat system, the width of the Hookean regime is determined by the shear stress (τ) instead of the shear strain (γ), whereas it completely disappears in the oDMS/AlS10t system due to the increase potential energy between particles. Both critical stress and strain at the onset point for strain hardening decreased with the increase of particle concentration. Frequency dependent measurements illustrates that it is the critical strain instead of the stress that controls the shear hardening behavior. Average distance of neighboring particles is assumed to play a key role in the formation of hydroclusters.

show abstract

Development and Challenges of Thermal Interface Materials: A Review

Cited by 30 publications

References 136 publications

Effect of organophilic group of coupling agent on the electrical performance of Boron Nitride/meta‐aramid composite paper

Effect of organophilic group of coupling agent on the electrical performance of Boron Nitride/meta‐aramid composite paper

Recent advances and challenges in thermal stability of PVA‐based film: A review

Strain controlled shear hardening behavior in suspensions of alumina spheres in a polydimethylsiloxane oligomer matrix

Contact Info

Product

Resources

About