Proceedings of the 2004 International Conference on Microelectronic Test Structures (IEEE Cat. No.04CH37516)
DOI: 10.1109/icmts.2004.1309485
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Development and extraction of high-frequency SPICE models for metal-insulator-metal capacitors

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Cited by 4 publications
(2 citation statements)
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“…The intrinsic MOSFETs are modeled by the standard BSIM3v3 model described in [3] and [4]. We developed new macromodels and also equations (1) and (2) for modeling of effects described in previous sections based on [1] and [2]. The device with capacitor compensated divider has wider bandwidth while the device with non-compensated divider has lower power consumption due to the higher resistance of polysilicon spiral.…”
Section: Discussionmentioning
confidence: 99%
“…The intrinsic MOSFETs are modeled by the standard BSIM3v3 model described in [3] and [4]. We developed new macromodels and also equations (1) and (2) for modeling of effects described in previous sections based on [1] and [2]. The device with capacitor compensated divider has wider bandwidth while the device with non-compensated divider has lower power consumption due to the higher resistance of polysilicon spiral.…”
Section: Discussionmentioning
confidence: 99%
“…Distributed models has been studied (Cai et al, 2004;Lee et al, 2006-1) and give interesting results, but are more complicated and not used in microelectronic design kit. The factor of merit traditionally used is the quality factor.…”
mentioning
confidence: 99%