Development and Mass Production of Double-Sided FPC Plated Directly on Polyimide Film Based on Molecular Bonding Technology

Happoya, Akihiko; Miyawaki, M.; Shigeru, Michiwaki; Hidekichi, Takii; Kudo, Tetsuichi; Möri, K.

doi:10.5104/jiep.16.450

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2014

2024

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Cited by 3 publications

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“…Applying this technology, the 2-layer FPC with low cost and good performance was developed [5]. In this article, we show that how we developed the ultrathin 4-layer FPC by applying the molecular bonding 44 technology and the reliability verification of the ultrathin 4-layer FPC prototype.…”

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confidence: 93%

Ultrathin 4-layer flexible printed circuits (FPC) fabricated by molecular bonding technology

Lin

Suzuki

Happoya

et al. 2014

2014 International Conference on Electronics Packaging (ICEP)

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We have developed the ultrathin 4-layer flexible printed circuits (FPCs) with the thickness of 135 urn. This 135urn ultrathin 4-layer FPC is made by the molecular bonding technology, by which the electroless plating (metallizing) can be directly applied to polyimide (PI) by using molecular junction agents. In this study, we show the fabrication procedures, the mechanism of direct copper plating, and the reliability verification of the ultrathin 4-layer FPC prototype.

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confidence: 93%