Development and reliability study of 3D WLCSP for CMOS image sensor using vertical TSVs with 3:1 aspect ratio

Xiao, Zhiyi; Yao, Mingjun; Zhou, Minghao; Dai, Fengwei; Fan, Jun; Xiang, Min; Zhang, Wei

doi:10.1007/s00542-016-3267-7

Cited by 14 publications

(2 citation statements)

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“…To meet the urgent market demand of small package size and high reliability performance for automotive CIS application, wafer level chip scale packaging (WLCSP) technology, using through silicon vias (TSV), needs to be developed to replace current chip on board (COB) packages [ 19 , 20 , 21 , 22 ]. Three-dimensional WLCSP with TSV technology takes advantages in shorter electrical interconnection, small form factor, high yield, and low cost [ 23 , 24 , 25 , 26 , 27 , 28 ].…”

Section: Introductionmentioning

confidence: 99%

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Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application

Zhou

Ma²,

et al. 2020

Sensors

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To meet the urgent market demand for small package size and high reliability performance for automotive CMOS image sensor (CIS) application, wafer level chip scale packaging (WLCSP) technology using through silicon vias (TSV) needs to be developed to replace current chip on board (COB) packages. In this paper, a WLCSP with the size of 5.82 mm × 5.22 mm and thickness of 850 μm was developed for the backside illumination (BSI) CIS chip using a 65 nm node with a size of 5.8 mm × 5.2 mm. The packaged product has 1392 × 976 pixels and a resolution of up to 60 frames per second with more than 120 dB dynamic range. The structure of the 3D package was designed and the key fabrication processes on a 12” inch wafer were investigated. More than 98% yield and excellent optical performance of the CIS package was achieved after process optimization. The final packages were qualified by AEC-Q100 Grade 2.

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Section: Introductionmentioning

confidence: 99%

“…Previous works have focused on package fabrication, rather than reliability performance. The structure they introduced suffered different failure modes in reliability tests, such as pad delamination [ 21 ] and oxide crack [ 22 ], which were unacceptable in automotive application.…”

Section: Introductionmentioning

confidence: 99%