Development and RF Characterization of High Density Integrated Substrate Technology

Chanchani, R.; Bethke, Don; Sandoval, Charles E.; Wouters, G.

doi:10.1109/tcapt.2007.898709

Cited by 5 publications

(1 citation statement)

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“…As for the increasing demand for compact layouts, high density interconnect (HDI) [13][14][15] is rapidly emerging as a promising manufacturing technology in the design process of advanced 5G devices since HDI-printed circuit boards (PCBs) support high-density attributes (e.g., laser drilled microvias) and they allow buried routing within multi-layered highly-interconnected structures. This opens the doors to the low cost system miniaturization and integration for mass production [15].…”

Section: Introductionmentioning

confidence: 99%

High Density Interconnect Microstrip Patch Antenna for 5G Base Stations with Integrated Filtering Performance

et al. 2018

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The elementary radiator of a planar array for next generation millimeter-wave (mm-wave) 5G base stations is described. The antenna is designed for high density interconnect (HDI) manufacturing for yielding a compact, densely-interconnected, and highly-integrable stacked structure. The layout of the single element is determined by directly optimizing key radiation features of the whole planar arrangement according to specific application-driven requirements. In addition, thanks to the exploitation of a spline-shaped modelling of the radiator, suitable performance in terms of impedance matching, realized gain, half-power beamwidth (HPBW), polarization purity, and inter-element isolation are achieved within the 28-GHz pass-band. Moreover, integrated out-of-band filtering capabilities are obtained in selected and wide non-contiguous stop-bands without additional circuitry.

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Section: Introductionmentioning

confidence: 99%