Development and validation of lead‐free wave soldering process

Forsten, A.; Steen, H.; Wilding, Ian; Friedrich, Jürgen

doi:10.1108/09540910010347872

Cited by 21 publications

(6 citation statements)

References 4 publications

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“…During wave soldering processes the concentration of copper in the solder bath increases in time due to dissolution of copper from the printed circuit board (PCB) pads and component terminations. As was reported earlier (Forsten et al , 2000), copper contents above 1 percent were found to give primary Cu 6 Sn 5 intermetallic crystals in the bath, causing changes in alloy fluidity and resulting in increased bridging. The fluidity of a solder, reciprocal of viscosity, also has an influence on the wettability.…”

Section: Introductionsupporting

confidence: 76%

Thermophysical properties and wetting behavior on Cu of selected SAC alloys

Fima

Gancarz

Pstruś

et al. 2012

Soldering &Amp; Surface Mount Technology

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Users who downloaded this article also downloaded: (2011),"Silver nanoparticles effect on the wettability of Sn-Ag-Cu solder pastes and solder joints microstructure on copper", Soldering & Surface Mount Technology, Vol. 23 Iss 3 pp. 150-160 http://dx.doi.org/10.1108/09540911111146908 (2012),"Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process", Soldering & Surface Mount Technology, Vol. 24 Iss 2 pp. 77-91 http://dx.If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -The purpose of this paper is to study the effect of copper concentration in near-eutectic liquid SAC solders on their thermophysical properties: viscosity, surface tension, density; as well as wetting behavior on copper substrates at 523 K. Design/methodology/approach -Viscosity, surface tension, and density were studied over a broad range of temperatures with the recently developed Roach-Henein method. The obtained results were compared with the data from modified capillary, maximum bubble pressure, wetting balance and dilatometric measurements. Wetting angles measured with wetting balance method were compared with the results of sessile drop measurements. Findings -The results obtained indicate that increasing concentration of copper in the alloy results in higher density, surface tension and viscosity, but differences resulting from copper concentration on wettability are relatively small. At 523 K, the density is: 7.097, 7.186, 7.232 g cm 2 3 , the surface tension is: 538.1, 553.5, 556.7 m Nm 2 1 , the viscosity is: 2.173, 2.227, 2.467 mPas, respectively, for alloys containing 0.41, 1.01 and 1.61 wt% of Cu. Wetting angles on copper substrates are similar within a margin of error for all compositions. The results of present study are compared with the available literature data and a relatively good agreement is observed. Originality/value -This paper provides the data of thermophysical properties of widely-used SAC solders including viscosity, of which there is little data in the literature. It is confirmed that the increased copper concentration increases viscosity, yet this effect is small and does not correlate with the wetting behavior.

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Section: Introductionsupporting

confidence: 76%

Thermophysical properties and wetting behavior on Cu of selected SAC alloys

Fima

Gancarz

Pstruś

et al. 2012

Soldering &Amp; Surface Mount Technology

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show abstract

“…Due to environmental and health concerns, efforts to replace conventional Sn-Pb eutectic solder with lead-free alternatives have begun. [1][2][3][4][5] Considering performance, reliability, cost, and resources, the Sn-Ag and Sn-Zn alloys have received the most attention. Compared with Sn-Ag solder, Sn-Zn solder has some advantages, such as low melting point (198°C), adequate mechanical strength, low cost, and abundant supply; thus its prospects for development are numerous, and it has great market potential.…”

Section: Introductionmentioning

confidence: 99%

Effect of small additions of alloying elements on the properties of Sn-Zn eutectic alloy

Chen

Ren

et al. 2006

Journal of Elec Materi

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Sn-Zn alloys have been considered for use as lead-free solders. Their poor wetting and oxidation resistance properties are the main obstacles that prevent them from becoming commercially viable solders. The effects of alloying elements, such as lanthanum, titanium, aluminum, and chromium, on oxidation resistance, wetting properties, and tensile properties of eutectic Sn-Zn solder are described herein. Results show the addition of alloying Ti, Al, and Cr can improve the oxidation resistance of Sn-9Zn solder. La, Ti, and Cr do not have much effect on the wetting properties, whereas Al worsens the wetting. Differential scanning calorimetry investigations reveal the solidus temperature of these solders to be ;200°C. Addition of Cr improves ductility while maintaining tensile strength.

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“…The resistance heating curve of cycle 2 attened around 450°C and revealed an almost constant speci c contact resistance around 30 µΩ•cm 2 until the end of the holding phase which lasted three hours at 520°C. The cooling phase of cycle 2, as well as the entire cycle 3, showed that the speci c contact resistance of the Cr/FM interface remained always below 40 µΩ•cm 2 . This suggests that oxygen, initially contained in the solder, was fully consumed after cycle 2 and that Cr oxide degradation was completed around 450°C during the heating phase of cycle 2.…”

Section: Resultsmentioning

confidence: 99%

“…Metals or alloys with a melting temperature below 300°C are classi ed among the low melting alloys [1]. Multiple applications require the use of these low melting alloys, e. g. wave soldering [2] or characterization techniques, such as the Combined Thermoelectric Measurement technique (CTEM) [3]. Liquid metals represent a corrosive environment; however, unlike corrosion by aqueous solution involving electro-chemical processes, corrosion by liquid metal relies on a physical-chemical process which is independent of electron transfer through the liquid.…”

Section: Introductionmentioning

confidence: 99%

Determination of the corrosion-oxidation turning point at the Field’s metal/chromium interface by electrical contact resistance measurement

Micallef

Stiewe

Müller

2023

Preprint

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The correlation of the electrical contact resistance measurement and microanalysis of the Field’s metal (FM)/Cr interface was used to determine the temperature-dependent reactions at the interface. Oxidation of Cr by oxygen contained in FM was identified through a sharp increase of the contact resistance around a certain temperature, above which the following resistance decrease was associated to a corrosion phase. The corrosion-oxidation turning point was evaluated around 390 °C. Cr saturation in FM combined with a complete consumption of the oxygen contained in the FM induced a stabilization of the interface giving a specific contact resistance of about 30 µΩ·cm2.

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Development and validation of lead‐free wave soldering process

Cited by 21 publications

References 4 publications

Thermophysical properties and wetting behavior on Cu of selected SAC alloys

Thermophysical properties and wetting behavior on Cu of selected SAC alloys

Effect of small additions of alloying elements on the properties of Sn-Zn eutectic alloy

Determination of the corrosion-oxidation turning point at the Field’s metal/chromium interface by electrical contact resistance measurement

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