Development of a GaAs monolithic surface acoustic wave integrated circuit

Baca, A.G.; Heller, Edwin J.; Hietala, V.M.; Casalnuovo, S.A.; Frye-Mason, Gregory C.; Klem, J.F.; Drummond, T. J.

doi:10.1109/4.782084

Cited by 13 publications

(5 citation statements)

References 3 publications

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“…Array optimization has led to the selection of seven heterogeneous coatings in the array (bare quartz, two polymer, two metal, one dendrimer, one metal oxide) that are in the process of being implemented into a series of portable systems for the targeted application (detection of concentration and discrimination among interferents of chemical warfare agents). Similar efforts at Sandia are under way to optimize integrated arrays of SAW devices for laboratory-on-a-chip applications on gallium arsenide substrates [26][27][28]. The optimization of arrays in these efforts via evaluation of all possible combinations of sensors is a significant step toward rigorous array architecture design for chemical sensing applications.…”

Section: Use Of Chemical Sensor Arraysmentioning

confidence: 99%

Array Optimization and Preprocessing Techniques for Chemical Sensing Microsystems

et al. 2002

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Physical sensors, defined by their direct chemical interaction with the sensing environment, are a valuable and often essential contribution to the solution of stringent chemical sensing problems. Methods for conditioning signals from these sensors to optimize their presentation to subsequent decision-making models in the signal processing flow are presented. The assembly of sensors into an array and the preprocessing of these signals are the two primary techniques for conditioning a chemical image for concentration detection, chemical discrimination, and, in some cases, odor localization. Array optimization involves locating the point at which adding additional sensors to an array generates more noise than information and is highly dependent on the application and number of analytes to be sensed or differentiated. Signal preprocessing techniques include noise reduction, feature extraction, the reduction of array inputs, and the scaling of individual sensor signals and provide a means by which to reconstruct an array of chemical sensor signals into a subset of information that enables a decisionmaking model to do its job with greater efficiency and accuracy. In this chapter, surveys of methods are accompanied by representative examples employing a wide variety of sensors including ChemFETs, chemiresistors, acoustic wave devices, and surface plasmon resonance sensors.

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Section: Use Of Chemical Sensor Arraysmentioning

confidence: 99%

Array Optimization and Preprocessing Techniques for Chemical Sensing Microsystems

et al. 2002

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“…Then, new resonant structures compatible with surface micromachining have to be built in III-V multilayered piezoelectric semiconductors substrates. Up to now, very few sensor systems have been built on such piezoelectric semi-conductor substrates [23,24] and the most succesful resonant microsensors have been desgned and built on squartz and silicon substrate. Nevertheess, composite sandwich wafers consisting of several epitaxial layers of doped and non-doped GaAs and AlGaAs are now commercially available at reasonable prices.…”

Section: Miniature Inertial Sensorsmentioning

confidence: 99%

<title>Design issues of resonant piezoelectric sensors</title>

Dulmet

2008

SPIE Proceedings

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This paper presents some issues governing the design of piezoelectric resonant sensors delivering a frequency output. We focus on BAW resonant sensors. As an application example, we consider the case study of miniature temperature sensors using strip resonators as sensing elements. In addition, we shortly discuss the current trends in the field of micromachined inertial acoustic sensors especially regarding miniaturization. Although currently available sensors of this type mostly rely on low frequency flexural vibrations, strip resonators micro-machined in III-V piezoelectric semi conductors multilayer substrates may take over a significant role for such application in the near future since they could bring the precision level characterizing essentially thickness shear resonators into monolithic sensors systems built upon completely integrated piezoelectric oscillators.

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“…The monolithic or heterogeneous integration of biological or chemical sensors with electronics allows the detection instrumentation to be miniaturized, inexpensive, and more functional [9]. With the better portability and affordability that these miniaturized sensors offer, the use of bio/chemical sensors will be expanded to new applications.…”

Section: Introductionmentioning

confidence: 99%

Bio/chemical sensors heterogeneously integrated with Si-CMOS circuitry

et al. 2009

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Sensor arrays for bio/chemical sensing generally incorporate different types of sensors with different substrate coatings, enabling increased sensor sensitivity and selectivity. However, a challenge in using multiple sensor systems is integration with RF electronic circuitry. This work presents the development of flexural plate wave (FPW) acoustic devices implemented in a sensor array and co-integrated on a Si-CMOS circuit. FPWs are highly sensitive to surface perturbations and indirectly sense analytes by detecting mass changes on the sensing plate surface. The sensors are placed in an oscillating circuit, where changes in the oscillation frequency are used to determine changes in the wave velocity due to mass loading by the analyte [1, 2]. Since FPWs are generated in thin plates, these devices are highly sensitive to loading and exhibit the highest mass sensitivities of any acoustic wave device [1,2]. In the work presented, FPWs are fabricated on Si/SiO 2 /Si native substrates, with the interdigitated transducers (IDTs) isolated from the active sensing surface. This innovative design enables the sensors to be fabricated and then separated from the native substrate, transferred, and bonded to the host Si-CMOS circuit. Thus, a new approach for the heterogeneous integration of FPW sensors and circuitry is provided. Following integration, the FPWs can be customized with either chemical membranes or biological functionalization. Moreover, this novel approach allows each sensor to be optimized independently before being connected to the host substrate. This paper presents the design, development, and integration process of an FPW sensor on Si-CMOS circuitry. KEYWORDS: Bio/chemical sensors, heterogeneous integration, acoustic wave devices INTRODUCTIONA bio/chemical sensor can be defined as a device that converts a biological/chemical state into a measurable signal. The bio/chemical sensing process involves molecular recognition of a biological and chemical species and transduction of the biological or chemical information into a measurable signal. Bio/chemical sensors have been used to detect and measure essential information about the state of our environment. Furthermore, in the area of clinical analysis, there is a need for reliable biological sensors that can provide fast and accurate answers to the diagnostic demands of medical care attendants. The threat of terrorism via chemical warfare agents (CWAs) also requires the use of bio/chemical sensors for crucial detection and sensing capabilities. Many sensors have been described in the literature for such applications [1][2][3][4][5][6][7]. They include electrochemical sensors, chemi-resistors and capacitors, metal-oxide gas sensors, field effect transistor (FET) sensors, calorimetric sensors, and acoustic wave sensors [1][2][3][4][5][6][7].

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Development of a GaAs monolithic surface acoustic wave integrated circuit

Abstract: -An oscillator technology using surface acoustic wave delay lines integrated with GaAs These oscillators are also promising for other RF applications.

Cited by 13 publications

References 3 publications

Array Optimization and Preprocessing Techniques for Chemical Sensing Microsystems

Array Optimization and Preprocessing Techniques for Chemical Sensing Microsystems

<title>Design issues of resonant piezoelectric sensors</title>

Bio/chemical sensors heterogeneously integrated with Si-CMOS circuitry

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