Development of a high particle loading novel copper ink for the fabrication of a three-dimensional hierarchical porous structure using direct ink writing and sintering

Tripathi, Vivek Mani; Sharma, Pawan; Tyagi, Rajnesh

doi:10.1007/s10934-024-01579-8

J Porous Mater

2024

DOI: 10.1007/s10934-024-01579-8

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Development of a high particle loading novel copper ink for the fabrication of a three-dimensional hierarchical porous structure using direct ink writing and sintering

Vivek Mani Tripathi,

Pawan Sharma,

Rajnesh Tyagi

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Development of a processing route for the fabrication of thin hierarchically porous copper self-standing structure using direct ink writing and sintering for electrochemical energy storage application

Tripathi,

Sharma,

Tyagi

2024

Journal of Materials Research

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Development of a processing route for the fabrication of thin hierarchically porous copper self-standing structure using direct ink writing and sintering for electrochemical energy storage application

Tripathi,

Sharma,

Tyagi

2024

Journal of Materials Research

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Development of a high particle loading novel copper ink for the fabrication of a three-dimensional hierarchical porous structure using direct ink writing and sintering

Cited by 1 publication

References 31 publications

Development of a processing route for the fabrication of thin hierarchically porous copper self-standing structure using direct ink writing and sintering for electrochemical energy storage application

Development of a processing route for the fabrication of thin hierarchically porous copper self-standing structure using direct ink writing and sintering for electrochemical energy storage application

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