Development of a Micro-Optical Distance Sensor with Electrical I/O Interface

Oka, Tôru; Nakajima, Hirochika; Shiratsuki, Akihide; Tsugai, Masahiro; Wallrabe, Ulrike; Hollenbach, Uwe; Krippner, Peter; Mohr, Jürgen

doi:10.1007/978-3-642-59497-7_127

Cited by 2 publications

(1 citation statement)

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“…A similar idea of a hybrid assembly was used for a micro-distance sensor working on the basis of the triangulation principle [22], ie, the position of the spot on the sensor's detector is dependent on the distance of the object to be measured. As with the spectrometer, the distance sensor is divided into two functional units: a passive optical chip again fabricated by LIGA technology including bent mirrors, 45 8 mirrors, and alignment structures for cylindrical lenses ( …”

Section: Distance Sensormentioning

confidence: 99%

Modular Microoptical Systems for Sensors and Telecommunication

Wallrabe

Mohr

2003

Sensors Update

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This paper focuses on fabrication and assembly processes of modular and hybrid microoptical systems in use in sensor and telecommunication fields. These microoptical systems are made by a huge variety of processes, which are commonly known as microsystem technology. Nevertheless, quite a lot of them are based on the LIGA process, since LIGA is an "assembly friendly" technology.Modular microoptical systems typically comprise several functions incorporating mechanical or electromechanical components beside the optical elements. The assembly of the diverse submounts and components is performed actively as well as passively. In many cases, all of these functions can be combined on one single chip. In several cases, however, a pair of chips, which is assembled in a flip-chip like way, is used.The framework of the paper leads to a definition of the terminus "modular microoptical system" and argues for the advantages of such a modular design approach. It closes with some remarks on automatic assembly strategies.

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Section: Distance Sensormentioning

confidence: 99%