2018
DOI: 10.1177/2516598418765357
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Development of a microstructured surface using the FIB

Abstract: Imparting periodic structures to a surface can make surfaces suitable for a specific functional performance in a variety of fields such as optical, electrical, biological and mechanical sciences. In this article, microstructures are fabricated on a cemented carbide tool using a focused ion beam (FIB) with the aim to reduce the cutting forces in a turning operation. The effects of FIB process parameters on the fabricated structures are analysed. The microtextured cemented carbide tool is utilized for the machin… Show more

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Cited by 11 publications
(4 citation statements)
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“…Various techniques were used to fabricate micro-patterns on mold like lithographic/etching technology, for instance, UV-ray and x-ray lithography [37], plasma etching and electron beam etching [38,39], focused ion beam machining [40], micro-milling [41][42][43], micro-EDM [44], CNC milling [45,46], laser ablation [47][48][49][50][51], etc The combination of micro or nano mold inserts with macro mold tools may be used to produce micro or nano elements. Micro and nano-combined components may be mass-produced; a HE procedure is provided.…”
Section: Micro Hot Embossing Processmentioning
confidence: 99%
“…Various techniques were used to fabricate micro-patterns on mold like lithographic/etching technology, for instance, UV-ray and x-ray lithography [37], plasma etching and electron beam etching [38,39], focused ion beam machining [40], micro-milling [41][42][43], micro-EDM [44], CNC milling [45,46], laser ablation [47][48][49][50][51], etc The combination of micro or nano mold inserts with macro mold tools may be used to produce micro or nano elements. Micro and nano-combined components may be mass-produced; a HE procedure is provided.…”
Section: Micro Hot Embossing Processmentioning
confidence: 99%
“…The penetration range of ions into the solids depends upon the atomic number of the ion species as the penetrating ions lose their energy by the electronic and nuclear energy losses. 80 Larger the atomic number, lesser will be the penetration depth into the target material at a given acceleration energy. Helium ions being the lightest (atomic weight 4) exhibit the penetrations range of the order of 300 nm, while heavy xenon ions (atomic weight 131) penetrate about 25 nm in the silicon.…”
Section: Focused Ion Beam: Technology and Applicationsmentioning
confidence: 99%
“…High feature resolution, high speed of processing, the low unit cost of manufacturing, the production of novel geometries, and rapid prototyping capabilities are vital in the evolution of many industrial sectors such as microelectronics, aerospace, defense, semiconductors, wafer processing, optics, telecommunications, and biotechnology. [1][2][3][4] In the last decades, there has been a significant advancement in various manufacturing processes such as focused ion beam machining, 5,6 electrochemical machining, 7 electric discharge machining, [8][9][10] and micromilling 11 for the manufacturing of complicated features. 12 All these processes have their own advantages and limitations in manufacturing.…”
Section: Introductionmentioning
confidence: 99%