Development of a new electroplating process for Ni–W alloy deposits

Mizushima, Io; Tang, Peter Torben; Hansen, Hans Nørgaard; Somers, Marcel A. J.

doi:10.1016/j.electacta.2005.04.050

Cited by 65 publications

(22 citation statements)

References 8 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…In our previous research the influence of an additional complexforming agent as glycine and triethanolamine in a Ni-W electrolyte containing citrate as the major complex-forming agent on the current efficiency and the composition of the deposit was investigated [8]. Characterization of Ni-W electrodeposits from these baths resulted in the occurrence of an unidentified peak in X-ray diffractograms at a Bragg angle of ≈41°2θ (for Cu Kα radiation) [8].…”

Section: Introductionmentioning

confidence: 98%

Identification of an anomalous phase in Ni–W electrodeposits

Mizushima¹,

Tang²,

Somers³

2008

Surface and Coatings Technology

Self Cite

View full text Add to dashboard Cite

Section: Introductionmentioning

confidence: 98%

Identification of an anomalous phase in Ni–W electrodeposits

Mizushima¹,

Tang²,

Somers³

2008

Surface and Coatings Technology

Self Cite

View full text Add to dashboard Cite

“…20,21 For example, using citrate, glycine, and triethanolamine as complexing additives, Mizushima et al have achieved optimized Ni-W alloy films with minimized residual stress. 22,23 Understandably, the concentrations of complexing agent and Ag + in plating solution require diligent control for targeted film composition. To sum up, in order for the electroplating of Sn-3.5wt.%Ag to proceed as intended, strict controls over plating formulations, additives, and plating methods are critical.…”

Section: Introductionmentioning

confidence: 99%

Effect of Polyethylene Glycol Additives on Pulse Electroplating of SnAg Solder

Chen

et al. 2007

Journal of Elec Materi

View full text Add to dashboard Cite

Eutectic Sn-3.5wt.%Ag alloy is one of the most promising lead-free solders in low temperature processes for wafer bumping. Near eutectic composition of deposited alloy films could be readily acquired by pulse electroplating with a proper combination of active ingredients including K 4 P 2 O 7 , KI, Sn 2 P 2 O 7 , and AgI, as well as polyethylene glycol (PEG), with molecular weights of 200, 600, 2,000, and 4,000, as an inhibitive agent. Pulse electroplating was carried out with current in alternating polarity to conduct electroplating and electropolishing sequentially. As a result, alloy films with grains of less than 1 lm and uniform surface morphology can be obtained. The addition of PEG was necessary for the stabilization of the plating baths to promote a wider process window for the desirable eutectic composition. Electrochemical characterization established that PEG with molecular weight of 4,000 exhibited the strongest inhibition behavior. In contrast, PEG with molecular weight of 200 demonstrated the least interference. Energy dispersive X-ray and differential scanning calorimeter data confirmed the formation of eutectic alloy as a function of deposition current density. X-ray diffraction results indicated that a biphasic structures of b-Sn and e-Ag 3 Sn was present in the as-deposited film.

show abstract

“…In addition, the hydrolysis of TMAB in the acid solution generated hydrogen gas 26) . Repeatedly trapping and desorption of hydrogen gas introduces high internal stress and defects 7,27,28) . Therefore, we conclude that the decrease in the tensile ductility in the sample electrodeposited with 0.1-5.0 g/L TMAB came from the hydrogen gas generated by TMAB hydrolysis.…”

Section: Resultsmentioning

confidence: 99%

Fabricating Bulk Nanocrystalline Ni–W–B Alloys by Electrodeposition

Matsui

Omura

2017

Mater. Trans.

View full text Add to dashboard Cite

In this study, we fabricated bulk nanocrystalline Ni-W-B alloys by electrodeposition, using trimethylamine-borane (TMAB) as a boron source, showing how B doping affects tensile properties. In electrodeposition, the TMAB concentration was varied from 0 to 5.0 g/L. Adding TMAB to the deposition bath increased the B content of the electrodeposited alloys up to 0.36 at%, but did not signi cantly change the W content or grain size. Adding more TMAB than 0.1 g/L drastically decreased the material s tensile elongation. Cross-sectional hardness tests on alloys with poor ductility revealed non-uniform hardness and that the initial layer had a high hardness of 6.3-8.7 GPa. This result indicated that the TMAB had immediately decomposed and that the boron decomposition product was mixed into the initial electrodeposited layer. In contrast, the alloys electrodeposited with 0.01-0.05 g/L TMAB showed good tensile elongation of 11%. Our results reveal the appropriate amount of added TMAB in order to produce electrodeposited bulk samples with good ductility.

show abstract

Development of a new electroplating process for Ni–W alloy deposits

Cited by 65 publications

References 8 publications

Identification of an anomalous phase in Ni–W electrodeposits

Identification of an anomalous phase in Ni–W electrodeposits

Effect of Polyethylene Glycol Additives on Pulse Electroplating of SnAg Solder

Fabricating Bulk Nanocrystalline Ni–W–B Alloys by Electrodeposition

Contact Info

Product

Resources

About