Development of a new improved high performance flip chip BGA package

Abstract

The recent advancement in high performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip BGA package with high pin count and targeted reliability has recently been developed by UTAC. The flip chip technology can accommodate VO count of more than five hundreds, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. Nonetheless, greater expectations on these high performance packages arose such as better substrate land estate utilization for multiple chips, ease in handling for thinner core substrates and improved board level solder joint reliability. A new design ofthe flip chip BGA package (patent pending) has been looked into for meeting such requirements.By encapsulating the flip chip with molding compound leaving the die top expo:jed, a planer top surface can he formed. And a flat lid can then be mounted on the planer moldldie top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process developmenl. of the new package and its advantages for improved solder joint fatigue life,, and being a multi-chip package and thin core substrate options. Finite element simulations have been employed for the study of its structural integrity, ~themoal and electrical performances. Detailed package and hoard level reliability test results will also be reported.

Simultaneous Escape Routing using Network Flow Optimization

“…Smaller size of electronic circuits with more pin count [1,2] is achieved using Integrated Circuits (ICs), which are based on ultra small-scale integration and often contain entire system on chip [3]. Majority of these ICs are BGA type with hundreds of connectivity pins [4][5][6]. Unlike conventional ICs where the pins exist at the boundary of the IC, BGA components have the connectivity pins arranged as a grid of small soldering balls under the entire body of IC.…”

Preparation and Properties of Glass Cloth-reinforced Meltable Thermoplastic Polyimide Composites for Microelectronic Packaging Substrates

“…Multifunctional epoxy resins (FR-4), cyanate esters or bismaleimide triazine (BT) resins are usually adopted as the composite matrices due to their great balance of mechanical, electrical, processing properties and cost-effectiveness. However, the conventional packaging substrates have always showed limited thermal resistance which could not endure the harsh thermal environment in the electronic packaging production line [3][4][5][6][7]. Hence, advanced packaging substrates with high thermal stability and good processability are required for high-density microelectronics packaging.…”